Quality & Reliability Engineering

As a Substrate Quality and Reliability Engineer you will drive substrate capacity expansion to influence key technology decisions for Intel package and assembly in TD and ramp phases. You will also be responsible to enable qual plans and strategies to meet product milestones and assess key risks to technology development activities at a component level and address product manufacturing challenges at substrate factories for future HVM stability. You will influence supplier process technologies and their interaction with assembly as well as substrate package induced customer facing issues and their validation. Role and Responsibilities include but are not limited to: - Develop, apply, and maintain quality and reliability standards for Substrate packaging components for Test Vehicle and Product. - Develop the integrated materials/process and technology targets to meet the requirements of product use case requirements and demonstrate maturity milestones. - Define inspection, screening, and testing mechanism to mitigate yield and reliability risks. - Develop reliability models by performing statistical analysis to more accurately categorize reliability risk to customer specification and field risk. - Deliver standardization in product qualification, manufacturing quality systems, and methods. - Influence, enable, and continuously engage with packaging technology development and partner engineering teams on process maturity to lower risks. - Develop new acceleration techniques, analytical tools, and quality screens to ensure the early identification of potential problems with every new technology and process. - Respond to customer requests or quality events as they occur - Make proactive recommendations for changes in specification or formulation to improve product quality and reliability. Master's degree with 2+ years of industry experience OR PhD degree in Materials Science, Electrical Engineering, Physics, Chemistry, Mechanical Engineering, Aerospace Engineering, Chemical Engineering, or a related engineering discipline.

• 2+ years of experience in at least one of the following areas: substrate manufacturing, semiconductor fabrication, package assembly, wafer-level processing, or board/system integration.
• 1+ years of experience in empirical data collection and statistical data analysis, reliability statistics, and design of experiments.
• Technical background in any of the below mentioned areas of substrate or semiconductor or Intel package technology with proficiency in one or more areas of manufacturing process development, material characterization, and development design validation.
• Technical understanding of capacitor, inductor, resistor passive component manufacturing process, functionality and testing procedures.
• Technical understanding of active component fabrication, functionality and testing procedures.
• Technical understanding of Intel's product certification methodology and integrated package risks with knowledge of modulators and controls.
• Technical understanding of accelerated life testing methods and reliability statistics.
• Programming or scripting experience for data analysis, such as Python or SQL.
• Join Intel in our mission to create world-changing technology that enriches the lives of every person on Earth. Bring your passion, expertise, and innovation to help us achieve extraordinary results together. Experienced Hire Shift:

Shift 1 (United States of America) Primary Location:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Annual Salary Range for jobs which could be performed in the US: $103,730.00-198,820.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.