Mechanical Engineering (Junior)

The Junior Thermal Research Engineer is responsible for supporting the design, modeling, and experimental validation of advanced thermal management systems for next-generation electronics cooling applications in data center, semiconductor test and aerospace and defense applications. The role combines thermal system design, modeling, experimentation, and data science techniques, with a focus on enabling faster design cycles and improved system-level insight.
Support the design and development of thermal management systems, including liquid cooling, two-phase cooling, and heat exchanger based architectures
Cooling system design including cold plates, cooling distribution units (CDUs) and passive two-phase solutions (heat pipes and vapor chambers)
Develop and apply thermal-fluid modeling tools (steady-state and transient) for system-level performance prediction, including pressure drop, heat transfer, and coolant distribution
Implement and use machine learning, AI and data-driven methods
Support data center cooling system modeling, including rack-level and component-level thermal architecture analysis
Conduct design of experiments (DOE) and support experimental testing, including instrumentation, data acquisition, and validation of models
Create and maintain CAD models and engineering documentation (e.g., SolidWorks designs, P&IDs, drawings, and test plans)
Assist in development of computational tools and simulation frameworks (Python, MATLAB) to support engineering decision-making and research activities
Collaborate with senior engineers and researchers to evaluate new cooling technologies, improve system efficiency and performance and identify key design tradeoffs
Basic (Required Qualifications) Bachelors or Masters in Mechanical Engineering or a related field.
Eaton will not consider applicants for employment, immigration sponsorship or support for this position.
This means that Eaton will not support any CPT, OPT, or STEM OPT plans, F-1 to H-1B, H-1B cap registration, O-1, E-3, TN status, I-485 job portability, etc. No relocation is offered for this position. Preferred Qualifications Master’s or PhD in Mechanical Engineering or a related field.
Academic focus in heat transfer, fluid dynamics, and thermal systems.
Graduate research in thermal-fluid sciences, cooling technologies, or electronics cooling strongly preferred.
Exposure to data center cooling and/or high-performance electronics thermal management.
All positions require use of information or access to hardware which is subject to the International Traffic in Arms regulations. Citizen, U.Permanent Resident, Political Asylee, or Refugee.
All Job Posting Locations Lancaster Remote Type On-Site
We celebrate diversity and are committed to creating an inclusive environment for all employees. Boyd is the trusted global innovator of sustainable solutions that make our customers’ products better, safer, faster, and more reliable. As a leader in the industry we focus on our people, customers, technology, innovation, materials, and market needs of today and performance requirements of the future. We are always looking for ambitious minds to help us deliver advanced technology to our customers. Boyd is the world’s leading innovator in sustainable engineered material that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years.

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