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Process Engineering Tech I

Teledyne FLIR

Be visionaryTeledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​As part of the uncooled detector (focal plane array) research and development team, the successful candidate will have responsibility for engineering wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for next generation infrared detector designs. As part of process development, hands-on wafer fabrication and characterization of pilot lots is required. The work is varied and challenging where creative problem-solving opportunities are many. The work environment is mixed general office and clean room/lab.Innovate new processes to enable the technology roadmapDesign and execute experiments, analyze data, draw conclusions, document, and communicate resultsOwn tools and process modules in the areaEstablish feasibility of new processes through hands‑on processing of pilot lots on production equipmentCharacterize results using quantitative metrology toolsAutomate or improve established processesDocument methods and workflows in MES‑ready formatPlan for statistical process control (SPC) practices as appropriateEvaluate production yield challenges and recommend improvements​Job Qualifications: Bachelor's degree or equivalent experience in related technical discipline required0-5 years of related experience desiredProficient computer skills - Word, Excel & Outlook Ability to communicate clearly in written and spoken EnglishStrong data analysis skills (fluency in Excel, MatLAB JMP, Python, SQL, or equivalent is helpful)Ability to use inspection equipment (microscopes, FIB/SEM, interferometers), semiconductor fabrication equipment, and wet bench chemistryDirect experience with one or more key wafer fabrication processesFamiliarity and/or strong desire to learn microelectronic/semiconductor and MEMS fabrication techniquesApplicants must be either a U.S. citizen or Perm ResidentDesired BackgroundWafer processing tools for semiconductor or MEMS fabricationInfrared detector technologyStatistical Process Control and Design of Experiments familiarity desiredLean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)What We OfferCompetitive Salary & Benefits PackageHealth, Dental, Vision, and Life Insurance starting Day 1Paid Vacation, Sick Time, and Holidays401(k) with Company MatchEmployee Stock Purchase PlanTuition Reimbursement for EducationFun Employee Events throughout the yearSalary Range: $90,800.00-$121,100.000The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​SummaryLocation: US - Goleta, CAType: Full time

Vacancy posted 21 hours ago
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