Package Development Engineering

Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life.
We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ. This role is focused on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing.
Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.
The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics.
3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
3+ years of experience with Finite Element Analysis tools
3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.

Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma.
Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.
Experience with designing, planning and executing experiments, along with interpretation of results.
Python, TCL, MATLAB) to streamline simulation workflows.
Knowledge in advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
Programming/script development with artificial intelligence and machine learning concepts.
Previous related work experience in a semiconductor foundry preferred.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. This role will require an on-site presence. *