Head of Technical Programme Management

About The Business
Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components. Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI‑enabled state‑of‑the‑art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high‑performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence. Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.'

Responsibilities
Senior Technical Program Manager will support the VP of FAE. The TPM manager must have hands‑on experience in semiconductor packaging technologies, such as flip chip and wire bond technologies and their applications. Must be familiar with all phases of IC packaging design and manufacturing processes. The TPM will support sales account managers and coordinate with the India factory RnD, NPI, and Production teams to ensure successful execution of customers’ projects and programs. Requires excellent verbal and written communication skills. Good interpersonal skills are essential.

Will Include The Following, Other Duties May Be Assigned

Coordinate and manage all customer project related activities in the factory, including establishing and executing plans and key milestones for the customer projects and delivering the objectives on time.

Manage and resolve customer issues through closely collaborating with Tata Electronics’ factories, RnD, NPI, and sales teams.

Coordinate customer visits to the factory

Establish technical credibility, building trust and strong relationships with the customers to ensure quick problem solving above and beyond customer expectations

Qualifications

Bachelor’s degree in engineering or related fields.

Minimum of 10+ years of customer facing experience in semiconductor manufacturing OSAT business, with an in‑depth understanding of the IC assembly, including wire bond and flip chip technologies products. Excellent flip chip assembly experience in a manufacturing facility is a plus.

Experience in working with customers and stakeholders of the program to resolve technical issues to support the business success of the program.

Strong verbal and written communication skills in English and Mandarin are essential along with interpersonal communications skills. Must be a team player with good organizational, computer and project management skills.

Be a quick learner, a good listener, like a fast pace and matrix organization, able to follow instructions and work independently.

Desired Experience Level

Bachelor’s degree with 10+ years of relevant experience

Combined 7+ years working experience with one or more major OSAT, design experience a plus

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