Thermal Systems Lead Engineer, Technical Loop #3621184

Be Part Of A Dynamic Team: Join a high-impact engineering team focused on advancing next-generation thermal management solutions for high-density data center and semiconductor environments. This organization is known for solving complex climate, infrastructure, and sustainability challenges through practical engineering innovation, product development, and systems-level thinking. This team is helping shape the future of data center cooling by developing advanced concepts across chip-level thermal design, liquid cooling, airside integration, and heat-rejection strategies. The role sits at the intersection of engineering analysis, product development, commercialization support, and industry engagement, requiring someone who can bring technical depth while influencing internal teams, customers, and industry stakeholders. What’s In Store For You: This is a full-time direct hire opportunity focused on high-growth data center thermal systems work. The role offers the opportunity to help define and commercialize advanced cooling architectures for AI, HPC, semiconductor, and mission-critical environments. Strong candidates will have the chance to influence early system concepts, guide technical decisions, support customer-facing solution development, and contribute to industry conversations around emerging data center cooling standards. Remote flexibility may be considered for exceptional candidates, with travel expected as needed for customer, technical, field, or industry-facing activities. How You Will Make An Impact: Lead technical development for advanced data center thermal systems focused on the chip/package-to-system cooling path. Develop and evaluate cooling concepts across direct-to-chip, cold plate, rack-level liquid cooling, airside cooling, and heat-rejection interfaces. Translate chip/package-level heat loads and power maps into practical cooling system requirements. Evaluate equipment, control capabilities, component limits, and operating modes across integrated cooling systems. Create technical documentation such as system concepts, thermal requirements, mode tables, sequence-of-operation inputs, reference design content, and commercialization support materials. Partner with product, engineering, modeling, controls, sales, field, and customer-facing teams to guide scalable cooling solutions. Support technical validation through modeling, simulation, lab testing, field feedback, and performance analysis. Serve as a technical resource for strategic customer opportunities, industry discussions, and internal decision-making. Help mentor other engineers and transfer knowledge across teams working on emerging data center thermal solutions. Do you bring proven success in chip-to-system thermal design for data center cooling? 8+ years of relevant engineering experience in thermal/fluid systems, mechanical engineering, data center cooling, semiconductor thermal management, or advanced electronics cooling. Direct experience with data center cooling systems, liquid cooling, direct-to-chip cooling, cold plates, CDUs/TCS, rack-level cooling, airside cooling, or heat-rejection integration. Strong understanding of chip/package-level thermal constraints and how they connect to rack, facility, and heat-rejection requirements. Experience with thermal modeling, CFD, test validation, or system-level analysis tools. Ability to think beyond one component and evaluate how the full cooling chain behaves across operating conditions. Strong communication skills with the ability to present technical concepts to customers, leadership, engineering teams, and industry stakeholders. Experience creating technical documentation, requirements, reference designs, test plans, or commercialization support materials. Exposure to OCP, ASHRAE TC 9.9, IEEE, ASME, or other data center / thermal standards organizations is strongly preferred. Experience with AI/HPC infrastructure, hyperscale data centers, semiconductor packaging, cooling product OEMs, or mission-critical engineering environments is preferred. Professional Engineering license, advanced degree, conference participation, standards work, publications, or patents are helpful but not required. #J-18808-Ljbffr Axiom-Path