FIB-SEM Engineer

TITLE: FIB/SEM ENGINEERFLSA STATUS: EXEMPTREPORTS TO: SR. MANAGER, WAFER CHARACTERIZATIONSUMMARY:Under the direction of the Sr. Manager of Wafer Characterization, the FIB/SEM Engineer performs physical characterizations and materials/failure analyses of product devices using state-of-the-art analytical FIB/SEMs, prepares sophisticated TEM lamella samples, analyzes results, summarizes findings, and supports the development of new designs, processes, or materials for magnetic recording heads, MRAM, or other devices. This position is in Milpitas, California.ESSENTIAL FUNCTIONS:Prepares sophisticated TEM lamella samples using different FIB/SEMs to support TEM analysesPerforms device cross-section imaging and metrology through high-resolution SEM/STEM imagingPerforms device failure analysis using different FIB/SEMs attached with EDSPerforms device structure analysis using FIB/SEM 3D tomographyActively participate in developing new recipes to improve the consistency and efficiency of sample preparation.Works with other team members to develop new techniques for sophisticated metrology and device/material failure analysisProactively responds to issues related to materials quality or the characterization process and initiates resolutionReviews and analyzes data, creates reports, and presents findings to panels, groups, teams, or departments as requiredInteracts and responds to inquiries from other product groups regarding process-related issues and product or device requirementsAdheres to all safety policies and procedures as requiredPerforms other duties of a similar nature or level*MINIMUM QUALIFICATIONS:Master’s degree in Materials Science, Chemical Engineering, or Physics and/or equivalent relevant experience; alternate qualifications Bachelor's degree in Materials Science, Chemical Engineering, or Physics with three years of experienceStrong knowledge of TEM lamella sample preparation and in-depth understanding of FIB/SEM instrument fundamentalsStrong interest in metrological, materials and failure analyses for the advancement of magnetic recording technology using knowledge and skills of different materials analysis techniques.Proficient in the use of Microsoft Office ApplicationsKnowledge, Skills, and Abilities:Proficient in the fundamental understandings of FIB/SEM, EDS, EBSD, and 3D tomographyKnowledge and ability to prepare TEM lamella samples, design and conduct experiments, interpret complex data, and recommend correction actionFundamental understanding or hands-on experience in TEM, STEM, EDS, and EELS is a plusKnowledge of semiconductor or basic HDD industry principles, practices, and techniquesKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentationsAble to independently create reports, presentations, and written analysis summariesStrong ability to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and managementDemonstrated ability to understand and carryout complex instructions given verbally or in writingAble to work productively and collaboratively with all levels of employees and managementAble to comply with all safety policies and proceduresDemonstrated organizational and time management skillsDemonstrated problem-solving and trouble shooting skillsFlexible and able to prioritizeThe annual base salary for this full-time position is between $120,819.00-177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.WORKING CONDITIONS:The FIB/SEM Engineer will work primarily in a laboratory environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed; wears a lab coat, gloves, and other safety equipment; spends a majority of time in a seated position, but occasionally stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department. #J-18808-Ljbffr Paycom - ATS