Senior Substrate Layout Engineer

Job DescriptionMercury Systems is seeking the best and brightest engineering talent to help us deliver cutting‑edge technology for mission‑critical aerospace and defense applications, advancing innovation where it matters most.In this role, our team is looking for a Senior Substrate Layout Engineer who will lead complex HDI PCB and substrate layout efforts for advanced microelectronic solutions used in aerospace, defense, and space systems. You will contribute directly to the design, layout, and optimization of rugged, high‑density microelectronics that operate in the harshest environments with exceptional reliability. This role serves as a technical authority within Mercury’s Microsystems business, driving layout excellence, influencing engineering standards, and shaping the technical direction of multiple high‑impact programs. Working within Mercury’s Integrator Mindset, you will collaborate across sites and disciplines to deliver breakthrough microelectronics that strengthen national security and support onshore trusted manufacturing.Job Responsibilities:Provide technical leadership focused on high‑speed interfaces and high‑density substrate layout techniques, guiding engineering teams to deliver high‑quality microelectronic solutionsDrive the design, layout, and analysis of complex electrical and mechanical systems, including high‑density interposers, substrates, and PCB layouts supporting digital, analog, power, and RF signals across multiple die (primarily flip‑chip)Manage high‑speed, multi‑layer packaging activities involving HDI structures, blind and buried vias, BGAs, RF routing, and design‑for‑test (DFT) considerationsCoordinate development processes to ensure alignment with supplier Design for Manufacturing (DFM) rules and capabilitiesCreate fabrication drawings that accurately represent design intent and collaborate with fabrication suppliers to ensure successful technical transferReview artwork, drawings, and design artifacts throughout the layout cycle and during final design reviews for fabrication and assemblySupport multidisciplinary investigations, feasibility studies, and design trades in collaboration with cross‑functional engineering teamsApply systems‑thinking to understand and communicate how design decisions impact the broader systemAssist the team beyond specific technical discipline as needed to meet program and organizational goalsRequired Qualifications:Bachelor’s or higher degree in engineering in electrical or electronics engineeringTypically requires a minimum of 4 years of experience as a high‑density package layout designer using industry‑standard tools Proficiency with Cadence APD+ physical and electrical constraint editors and experience with HDI stack‑ups, blind/buried micro‑vias, and fine‑pitch routing (e.g., 15µm/15µm to 2µm/2µm or below)Knowledge of Cadence Constraint ManagerExperience with 2.5D devices, interposers, substrates, flip‑chip, and high‑end package designUnderstanding of layout techniques in digital, analog, and/or RF designsHigh‑end package design experience, especially in advanced substrate or interposer designs.Ability to work within a Cadence schematic/netlist‑driven layout workflow; experience with CAM tools for manufacturing data validation (CAM350 and Blueprint preferred)Understanding of layout techniques for digital, analog, and RF designs; knowledge of JEDEC and IPC design, fabrication, and assembly specificationsKnowledge of electronic packaging techniques and collaboration with mechanical engineering teams to support 3D modeling for fit checks and thermal analysesWorking knowledge of JEDEC and IPC design, fabrication, and assembly specificationsExperience creating assembly documentation and fabrication deliverables per company and industry standards “This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens.”Preferred Qualifications:Understanding of signal‑integrity fundamentals including impedance, crosstalk, and power‑integrity considerationsKnowledge of substrate materials, stack‑up creation, and packaging architecturesExperience with Through‑Silicon Via (TSV) or interposer‑based designs or die stackingFamiliarity with Ansys or Cadence simulation tools such as Sigrity and ClarityAbility to support electrical engineers with netlisting and component‑selection tasksExperience routing high‑frequency SERDES or RF interfacesExperience with scripting or automation for layout workflowsJob RequirementsWhy should you join Mercury Systems?Mercury Systems is a technology company that makes the world a safer, more secure place. We push processing power to the tactical edge, making the latest commercial technologies profoundly more accessible for today's most challenging aerospace and defense missions. From silicon to system scale, Mercury enables customers to accelerate innovation and turn data into decision superiority. Headquartered in Andover, Massachusetts, Mercury employs more than 2,300 people in 24 locations worldwide. To learn more, visit mrcy.comOur CultureWe are committed to making Mercury a great place to work, no matter where our employees are located. We offer a casual and enjoyable atmosphere that allows employees to learn and grow. We help and care for one another and work as one to achieve results for us and for our customers. We value communication and transparency, and strive to foster two-way dialogue at all levels of the organization. We are committed to lifelong learning, offering comprehensive skills training and tuition reimbursement. Whether you're just starting out on your career journey or you are an experienced professional, it's important to us that you feel recognized and rewarded for your contributions.To find out more about Why Mercury?, or visit the Mercury Community or find answers to general questions at Mercury FAQsMercury Systems is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex (including pregnancy), sexual orientation, gender identity, national origin, genetic information, creed, citizenship, disability, protected veteran or marital status.As an equal opportunity employer, Mercury Systems is committed to a diverse workforce. In order to ensure reasonable accommodation for individuals protected by Section 503 of the Rehabilitation Act of 1973, the Vietnam Veterans' Readjustment Act of 1974, and Title I of the Americans with Disabilities Act of 1990, applicants that require accommodation in the job application process may contact the number below for assistance.(978) 256-1300Click here read about our recent press release.Job DetailsJob Type: Full-timeCategory: EngineeringSalaried: Salaried