Principal Equipment Engineer (Multiple positions)

Principal Equipment Engineer (Multiple positions), TSMC Arizona Corporation, Phoenix, AZ. Retrofit component and parameters settings to improve tool performance and availability for diffusion, thin film, lithography or etching equipment in a clean room environment. Install and qualify new tool sets according to planned schedules, to add capacity in a timely manner. Solve critical equipment issues, improving tool uptime availability and utilization efficiency. Implement best known methods in hardware to control tools performance and utilization. Identify and pursue opportunities for hardware capability enhancement, driving defect reduction. Communicate with cross‑function engineers or vendors, and serve as a module liaison with facilities, vendor, and manufacturing shift personnel. 40 hrs/week, Mon‑Fri, 8:30 a.m. - 5:30 p.m. Minimum Requirements Must have a Bachelor’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 5 years of experience in an engineering role. Company will also accept two (2) years of additional experience in lieu of a Bachelor’s degree. Must have 3 years of experience with the following: Semiconductor manufacturing principles, practices and techniques as they relate to equipment engineering and maintenance; At least one of the following software: Creo 3D CAD, Pro‑E, AutoCAD, MATLAB, COMSOL, Solidworks; Planning/scheduling within a manufacturing environment for tool install construction projects; At least one of the following: mechanical systems knowledge with a focus on semiconductor lithography track equipment robotics, pneumatics, or electrical systems; physics and chemistry principles as they apply to semiconductor lithography processes; or troubleshooting complex defect and hardware issues to resolve root cause issues; Overseeing junior engineers. #J-18808-Ljbffr TSMC Arizona Corporation