Senior Interposer IC Design Engineer (CoWoS 2.5D/3D)
Broadcom
A leading semiconductor company in San Jose is seeking experienced engineers to design advanced 2.5D and 3D interposer solutions. The ideal candidate will work on custom routing, bump map designs, and ensure adherence to packaging and signal integrity requirements. A strong background in TSV design, automation skills, and experience with relevant EDA tools are essential. This role offers a competitive salary and comprehensive benefits package, fostering a dynamic team environment. #J-18808-Ljbffr Broadcom
Vacancy posted 4 days ago
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