Product Engineer

Job Title

Work on new product introduction and ramp-up of CMOS Image Sensors (CIS) and ASIC products from initial tape-out to mass production. Collaborate with design, test, reliability, and packaging teams to troubleshoot issues and support product development. Perform design rule checks and product validation to ensure robust product design; defining new product process criteria and GDS checks for tape-out. Develop comprehensive product characterization and testing plans with R&D and foundry teams to ensure products performance meets requirements. Ensure product roadmap success by identifying improvement opportunities through physical/electrical failure analysis, process optimization and defect reduction. Access pixel performance through statistical analysis of electrical and functional metrics at both wafer- and chip-level testing. Work with quality engineers to address customer complaints, implement corrective actions, and track improvements after solution implemented to minimize field returns. Collaborate with different foundries to optimize processes, including silicon, color and packaging processes, enhancing overall product performance. Work with testing engineers to develop, verify, and release CP and FT testing programs; perform sensors validation on manual testing board. Improve product yield by process and layout optimization; analyze yield data and drive improvement actions. Define production testing specifications, ensure product yield on target, and reduce process and test fluctuating issue for timely ramp-up. Ensure products meet AEC Q-100 standards and other relevant automotive specifications. Work with foundries to drive continuous yield enhancements, continuous improvement plans (CIP), and best-known-methods (BKM) updates throughout the product lifecycle. Deliver cutting-edge CIS solutions for the automotive industry.

Requirements: Master's degree in Electrical Engineering, Physics, Material Science or a related field. One year's experience in product engineering. Experience shall include: Support IC-design clients in ramping up the new tape out (NTO) products, sustaining yields for high‐volume production products and improving product quality and functionality. Design rules checks and layout review to ensure robust product design. Experience in raw materials, production processes, quality control, costs, and techniques for maximizing the effective manufacture of products. Experience in cross-team work for joint project development; coordination with client, Fab and support teams to identify improvement opportunities and implement solutions. Monitor the CP and FT testing result to gate and resolve issues in mass production. Experience in physical failure analysis techniques, such as TEM, EDX, and OBIRCH.

Annual base salary for this role in California, US is expected to be between $156,853 - $160,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.