Principal / Lead DSP & Systems Architect — Ultra High-Speed SerDes

About the Company Omni Design Technologies provides high-performance, ultra-low power IP solutions across advanced CMOS nodes, enabling differentiated SoC architectures for AI/ML accelerators, hyperscale datacenter interconnects, optical networks, and next-generation wireline platforms. We partner with market leaders globally and are scaling rapidly, and are seeking senior technical leadership to define the next generation of ultra high-speed SerDes IP at 448G and beyond. Job Description We are seeking a Principal / Lead DSP & Systems Architect to own the architectural direction of ultra high-speed SerDes platforms targeting 448G per lane and emerging post-448G standards, spanning both electrical (chip-to-chip, backplane, copper cable) and optical (IM‑DD and coherent) interfaces. This individual will drive end‑to‑end link architecture, DSP algorithm design, and ADC/DAC‑based transceiver partitioning, serving as the primary technical interface with strategic customers and standards bodies. The ideal candidate combines deep expertise in high‑speed link theory, advanced equalization and FEC, PAM/multi‑level and coherent signaling, and hardware‑aware DSP implementation, with a track record of delivering SerDes IP into silicon at the bleeding edge of the wireline and optical roadmap. Key Responsibilities Architecture & Roadmap: Define DSP and system architecture for 448G and post‑448G SerDes IP across electrical and optical interfaces — including ADC/DAC‑based transceiver partitioning, modulation choice (PAM4/PAM6, IM‑DD, coherent), and FEC strategy — and shape long‑term roadmap toward 1.6T and 3.2T link aggregates. Customer & Standards Engagement: Lead technical engagement with hyperscale, AI accelerator, and optical module customers; represent the company in OIF CEI, IEEE 802.3, and related standards activities. End‑to‑End Link Modeling: Build and maintain MATLAB/Python models of the full link across electrical and optical media: channel response (backplane, copper cable, chip‑to‑chip, fiber), TX/RX impairments, jitter (RJ/DJ/BUJ), crosstalk, reflections, optical impairments (CD, PMD, laser phase noise, optical SNR), ADC/DAC quantization, and FEC performance under realistic BER/FLR targets. DSP Algorithm Architecture: Own the DSP pipeline across electrical and optical paths — FFE, DFE, MLSE/MLSD, CTLE‑DSP partitioning, adaptive equalization (LMS, sign‑sign LMS, blind adaptation), timing recovery and CDR, baseline wander correction, IQ/skew calibration, PAM demapping, and integration with KP4 / concatenated / soft‑decision FEC. For optical links, additionally drive chromatic dispersion (CD) compensation, polarization demultiplexing, carrier phase and frequency recovery, and nonlinear compensation. Mixed‑Signal Co‑Design: Drive ADC/DAC architectural decisions — sample rate, resolution (ENOB), time‑interleaving, calibration strategy — and align analog front‑end, CTLE, and clocking specs with DSP performance budgets. Fixed‑Point & Implementation Trade‑offs: Drive wordlength optimization, parallelism and pipelining strategies for multi‑hundred‑GSps datapaths, and float‑to‑fixed methodology to balance BER performance, area, and pJ/bit power efficiency. Specifications & Cross‑Domain Integration: Generate block‑level specs for DSP datapaths, FEC, calibration, ADC/DAC, AFE, and clocking; align decisions across digital, mixed‑signal, packaging, and SI/PI domains. DSP‑to‑RTL Handoff: Translate DSP reference models into hardware‑friendly architectures with bit‑true/cycle‑accurate alignment, and partner with RTL and verification teams on micro‑architecture, latency, and memory trade‑offs. Silicon Bring‑up & Validation: Partner with validation and lab teams to correlate post‑silicon BER, eye, and link‑training results with modeled assumptions; define KPIs (BER, FLR, link margin, power, latency) and debug methodologies. Mentorship & Thought Leadership: Guide DSP, systems, and hardware engineers; develop reusable models and best practices; contribute to architecture reviews, IP innovation strategy, and customer‑facing technical engagements. Qualifications Graduate degree in EE, Communications, or Signal Processing; PhD strongly preferred. 10+ years in high‑speed SerDes or wireline/optical link DSP/systems architecture, with direct exposure to 112G/224G silicon and a clear path into 448G and beyond across electrical and optical interfaces. Proven ownership of end‑to‑end link budgets with cascaded impairment analysis across channel (electrical and/or optical), AFE, ADC/DAC, DSP, and FEC. Deep expertise in: PAM4/PAM6 and coherent wireline/optical signaling; advanced equalization (FFE, DFE, MLSE/MLSD, Tomlinson‑Harashima); optical DSP (CD/PMD compensation, polarization recovery, carrier phase/frequency recovery) for candidates with optical exposure; adaptive algorithms and link training; KP4 and soft‑decision FEC; high‑speed ADC/DAC architectures (time‑interleaved, calibration, ENOB‑driven design); CDR and timing recovery at multi‑hundred‑Gbaud rates; jitter/crosstalk/SI and optical impairment modeling; fixed‑point DSP and bit‑true modeling; MATLAB/Python link simulation; DSP‑to‑RTL methodology. Familiarity with OIF CEI (CEI‑224G, CEI‑448G), IEEE 802.3 high‑speed Ethernet, and relevant optical standards (e.g., OIF coherent agreements, IEEE 802.3 optical PHYs). Track record of defining specs consumed by RTL, DSP, mixed‑signal, verification, and validation teams. Strong communication skills with VP‑ and CTO‑level stakeholders at hyperscale and module customers. What We Offer Highly competitive compensation, performance incentives, and substantial technical influence. Direct ownership of DSP and systems architecture for SerDes IP at the bleeding edge of the wireline and optical roadmap. Strategic relationships with top‑tier hyperscale, AI, and optical customers. A technical culture that values rigor, clarity, and architectural craftsmanship. #J-18808-Ljbffr Omni Design Technologies, Inc.