Media & Collateral Innovation Engineer
Intel Corporation
Intel Corporation in Phoenix, AZ is seeking a TD Media and Collaterals Development Engineer to design and optimize media and collaterals for assembly processes, delivering innovative solutions for future packaging technologies. The role emphasizes DOE/SPC knowledge, mechanical design using SolidWorks or AutoCAD, and hands-on work with assembly equipment and materials to meet quality, reliability, and yield goals on aggressive schedules. #J-18808-Ljbffr Intel Corporation
Vacancy posted 1 day ago
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