C2C Bonding Engineer - Semiconductor Integration Lead
Samsung Electronics Perú
Samsung Austin Semiconductor is seeking a Copper-to-Copper (C2C) Bonding Expert to lead development, optimization, and manufacturing integration of advanced wafer bonding technologies for CMOS Image Sensors. You will drive innovations in hybrid bonding processes enabling stacked sensors with superior yield and reliability. This full-time on-site role requires 5+ years BEOL/process integration experience and 3+ years bonding experience, with a strong emphasis on process-yield interactions and #J-18808-Ljbffr Samsung Electronics Perú
Vacancy posted 4 days ago
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