Advanced Packaging Process Development Engineer - Principal

200 NeoCity Wy, Kissimmee, FL 34744, USA Position Summary As an Advanced Packaging Process Engineer, you will own all assigned process steps. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the specific process disciplines assigned using tool knowledge/experience, SPC, Qual data, and other available resources. The candidate will have extensive collaboration with the area maintenance team and equipment engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, integration, and production. If you are a self‑motivated team player who thrives in a fast‑paced, constantly changing environment, passionate about building great products and learning new technologies, this is the job for you! Major Areas of Accountability Provide technical leadership and management of Advanced Packaging Semiconductor processes in support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas: Wafer Singulation, Solder Bumping, Maskless Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test. Work with equipment engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions, and eliminate chronic and long‑term downtime. Collaborate with continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk. Manage new tool qualifications to increase fab capability, capacity, lower costs and improve yields. Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations. Participate in cross‑functional teams that create efficiencies across all layers of the organization. The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. Required Qualifications Semiconductor Industry experience required: 10+ years with BS, 7‑10 years with MS, 5+ years with PhD in Materials Science, Physics, Electrical or Chemical Engineering or other relevant Engineering disciplines. Prior experience with Die Attach, Pic & Place, Thermal Compression Bonding, Hybrid Bonding, Compression Molding, Wafer Singulation, Grinding and/or Micro Ball Attach / Reflow. Proven understanding of assigned process steps and interrelation to previous and subsequent process steps in the Semiconductor manufacturing and Advanced Packaging fields. Experience with application of structured problem‑solving methodology. Positive interpersonal skills, highly energetic and self‑motivated. Demonstrated ability to meet requirements and deliver results. Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs. Experience creating and managing process steps. Strong experience with setup and use of SPC charts. Experience with Advanced Process Control Systems (APC). US Citizenship Required: This position will require the holding of, or ability to obtain, a US government security clearance. Preferred Qualifications Silicon Interposer and Fan Out experience. Salary The annual salary range for this role is $136,960 – $205,440. Pay offered is based on many factors including, but not limited to, the job‑related experience, skills, education, and credentials of each candidate. Benefits SkyWater offers competitive salary and the opportunity to participate in incentive plans as well as other employee financial benefits, including 401(k) match, life insurance, and opportunities to purchase SkyWater stock at a discounted rate. Additionally, a comprehensive benefits package promotes a healthy life and includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short‑ and long‑term disability, paid time off, paid holidays, an on‑site fitness facility, and an on‑site self‑serve market. EEO Statement / Accommodations SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at View phone number on click.appcast.io or View email address on click.appcast.io. #J-18808-Ljbffr SkyWater Technology Inc.