Sr. Wet Etch Process Development Engineer

Position Summary We are looking for a hardworking and passionate Wet Etch Process Development and Integration Engineer for our Florida Advanced Packaging site. In this role you will lead, develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding, Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan‑Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management. Major Area of Accountability New process development, transfer, integration, and ownership in a manufacturing environment. Develop or integrate robust manufacturable process recipes for Foundry customers in Wet Etch / Cleans. Lead one or more teams for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications. Utilize metrology tools to characterize and document process results for transfer to production. Investigate and drive integration changes for improved device performance and yield improvement. Lead a team of process integration and tool engineers to find processing marginalities and make improvements. Routinely monitor selected in‑line and end‑of‑line SPC charts for trends or excursions that can be addressed by integration changes. Monitor and improve electrical test parametrics through feedback and improvement to integration. Directly interface with customers as a team and technical leader. Act as technical lead and project manager integrating customer device requests with team activities. Required Qualifications BS in Engineering, MS/PhD preferred. Major in Physics, Electrical Engineering, Materials Science or equivalent. 10+ years of experience with BS, 7-10 years with MS, 5+ years with PhD. Experience in wafer fab process development and chemical selection. Knowledge of MEMS, Photonics, CMOS or Packaging device and integration. Proficiency in DOE and SPC; knowledge of Six‑Sigma concepts and applications. Demonstrated project management and team leadership skills and/or defined training and relevant experience. Clear problem‑solving capability, data‑driven, inventive solution orientation and ability to articulate thought processes. Experience with customer interfacing to solve problems and transfer processes for co‑development of products. Ability to work independently and lead cross‑functional teams for problem solving. Preferred Qualifications Experience with PVD, CVD, electroplating Cu and/or Au, dry or wet etch, electrical test, metrology, photolithography, wafer bonding or CMP. US Citizenship Required This position requires the holding of, or ability to obtain, a US government security clearance. Salary Range $136,960 – $205,440 per year, based on experience, skills, education, and credentials. Benefits Competitive salary, incentive plans, 401(k) match, life insurance, stock purchase plan, comprehensive health, dental, vision, mental health, short‑term and long‑term disability, paid time off, paid holidays, on‑site fitness facility, and on‑site self‑serve market. Accommodation SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at View phone number on click.appcast.io or View email address on click.appcast.io. #J-18808-Ljbffr SkyWater Technology Inc.