Senior or Principal Product Manager, Texas Institute for Electronics

Senior Or Principal Product Manager, Texas Institute For Electronics

The purpose of this role is to drive the product strategy and roadmap for TIE's advanced 2.5D/3D microsystems integration platforms, ensuring alignment between engineering execution, market needs, and business objectives. By serving as the bridge between technical teams and customer requirements, you will facilitate cross-functional collaboration and strategic partnerships to enhance product success and industry presence.

Responsibilities include:

• Owning the product strategy and roadmap for TIE's advanced 2.5D/3D microsystems integration platforms, aligning engineering execution with market needs and business objectives.
• Authoring and maintaining comprehensive Product Requirements Documents (PRDs) that guide TIE's process development, EDA integration, and packaging engineering teams.
• Driving cross-functional collaboration across internal teams—including packaging R&D, process engineering, design automation, and product marketing—to ensure product features and releases are cohesive and aligned with overall strategy.
• Engaging closely with customers and industry partners to align our capabilities with evolving industry needs.
• Serving as a technical champion for 2.5D/3D integration – leveraging your deep understanding of advanced packaging technologies to guide internal decision-making.
• Developing and executing detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication to drive predictable delivery of platform milestones.
• Creating technical documentation and collateral that support customer design teams and highlight the unique value of TIE's technologies.
• Monitoring advanced packaging market trends and competitive developments, providing actionable insights to inform product positioning, feature prioritization, and differentiation.
• Championing a culture of accountability and transparency across all product workstreams.
• Other related functions as assigned.

Required qualifications include:

• Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
• Industry experience: 5+ years for Senior Product Manager or 10+ years for Principal Product Manager in semiconductor packaging, microsystems integration, or related microelectronics product development.
• Technical expertise in advanced packaging technologies and heterogeneous integration techniques.
• Process & EDA familiarity with semiconductor fabrication processes and electronic design automation flows.
• Exceptional communication skills and startup DNA.
• Execution mindset with demonstrated experience driving progress across multiple initiatives.
• Location: Austin, Texas preferred with hybrid work arrangements possible.

Preferred qualifications include:

• Advanced Degree: MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field.
• Program leadership experience with end-to-end ownership of complex programs.
• Vendor/partner management experience.
• Industry background at a leading semiconductor foundry or packaging house.