ASIC Packaging Engineering Intern
Advanced Micro Devices Inc
Advanced Micro Devices, Inc. (AMD) is seeking a highly motivated ASIC Package Engineering intern/co-op. You will join a team of engineers working on new packaging technology, supporting design and development, and contributing to yield improvements. You will gain hands-on experience with substrate, interposer and bump designs, design verification, and interaction with partners to optimize cost and performance. This internship offers real-world impact and networking opportunities. #J-18808-Ljbffr Advanced Micro Devices, Inc.
Vacancy posted 3 days ago
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