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ASIC Packaging Design Intern (Co-op)

Advanced Micro Devices

Advanced Micro Devices is seeking a highly motivated ASIC Package Engineering intern/co-op to join our team in Austin, TX or Boxborough, MA. You will work full time in a hybrid or onsite structure for the co-op/intern term. As a student in Electrical, Computer, or Mechanical Engineering (or related fields), you will assist with substrate, interposer and bump design, design verification, and yield analysis while collaborating with experienced engineers on real AMD products. #J-18808-Ljbffr Advanced Micro Devices

Vacancy posted 2 days ago
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