Principal ASIC Package Design Engineer (FC-BGA/MCM)
K2 Space
K2 Space is seeking a Principal ASIC Package Design Engineer to lead advanced FC‑BGA and MCM packaging strategies for high‑performance mixed‑signal and digital SoCs. You will own the end‑to‑end package architecture, engage with vendors, and drive roadmaps from architecture through production ramp. You will act as the technical authority for package design, influencing silicon and system architecture while ensuring first‑pass success for complex, high‑speed, power‑dense ASICs. #J-18808-Ljbffr K2 Space
Vacancy posted 1 day ago
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