Director, Probe and Post Fab (Hopewell Junction)

The Director of Probe & Post‑Fab Operations is responsible for end‑to‑end leadership of wafer manufacturing activities from electrical probe through post‑fab processing, including wafer thinning and back side metallization. This role owns the transition from electrical qualification to wafer readiness for assembly, with accountability for yield, cost per wafer, wafer integrity, reliability, cycle time, and operational scalability.A key responsibility of this role is to define and execute the automation strategy for Post‑Fab Operations, ensuring that post‑fab manufacturing systems, controls, and data integration resemble front‑end fab standards, while supporting a phased approach to material handling automation (onsemi assembly test operations and external assembly)onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.More details about our company benefits can be found here:We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.

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RequiredBachelor’s degree in engineering or related technical discipline12+ years of semiconductor manufacturing experienceDemonstrated leadership in Probe and/or Post‑Fab OperationsExperience driving manufacturing system standardization and/or automationProven ability to lead organizations through operational changePreferredAdvanced degree (MS or PhD)Experience leading multi‑area manufacturing organizationsThin‑wafer, power, or analog device manufacturing backgroundExperience deploying MES, tracking, or automation in non‑fab environmentsSalary: onsemi is excited to share the base salary range for this position is $164,800 to $296,600 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. Leadership & StrategyDefine and execute the operational, technical, and automation strategy for Probe & Post‑Fab OperationsEstablish a phased automation roadmap for Post‑Fab, balancing near‑term practicality with long‑term scalabilityEnsure Post‑Fab systems and execution models align with fab‑level manufacturing standardsOperational OwnershipFull accountability for yield, cost per wafer, cycle time, and quality from probe through post‑fabLead stable execution of post‑fab operations during automation transitionsDrive continuous improvement while maintaining production continuityAutomation & Manufacturing SystemsLead the evolution of Post‑Fab Operations toward a fab‑like operating model, including: 
MES usage, tracking, and lot genealogySPC, recipe control, and data integrityStandard work and operational disciplineEstablish an automation approach where: 
Short‑term: tool‑to‑tool transport may remain manualLong‑term: material delivery and flow enable automated solutionsPartner with IT, Manufacturing Systems, and Facilities to ensure scalable, standardized implementationTechnical StewardshipProvide oversight of: 
Probe strategies and probe card utilizationWafer thickness targets, TTV, warp, and bow controlsBack side metallization robustness and compatibility with assembly flowsEnsure manufacturing readiness for new products and volume rampsOrganization & TalentBuild, develop, and retain high‑performing engineering and operations teamsEstablish clear expectations for managers and technical leadersPromote a culture of discipline, accountability, and continuous improvementCross‑Functional IntegrationServe as the primary interface to: 
Front‑end Fab leadershipAssembly and packaging organizationsQuality, reliability, supply chain, and IT teamsSupport capital planning, automation investments, and cost‑reduction initiativesFull timePosting Date: 2026-06-29