Principal Engineer - Low Power Chip Architect / System Engineer

Company:Qualcomm Technologies, Inc.Job Area:Engineering Group, Engineering Group > ASICS EngineeringGeneral Summary:We are seeking a senior-level Low Power Chip Architect / System Engineer with deep expertise in mixed-signal IC and system design and a proven record of chip-level technical leadership . This is a high-impact role responsible for defining the architecture, driving transistor-level design, and enabling system-level integration of ultra-low-power integrated circuits (ICs) for Robotics and Industrial IoT (IIoT) applications.The successful candidate will bridge high-performance Analog Front Ends (AFEs) with digital logic and firmware, leading programs from initial architecture and specification through simulation, verification, tape-out, and early silicon bring-up . This role requires strong cross-functional collaboration, sound architectural judgment, and the ability to operate effectively in ambiguous environments.** Position requires to be onsite in San Diego, 5 days a week. **Minimum Qualifications:Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.ORMaster's degree in Science, Engineering, or related field and 7+ years of ASIC design, verification, validation, integration, or related work experience.ORPhD in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.Responsibilities:Architecture & Technical LeadershipDefine and support end-to-end system architecture , including partitioning across analog, digital, firmware, and system domainsDrive architectural trade-offs across power, performance, noise, latency, and silicon areaPartner with chip leads and system leads from concept definition through silicon bring-up and validationMixed-Signal Design & IntegrationLead feasibility studies and transistor-level design of mixed-signal building blocks including ADCs, DACs, PLLs/DLLs, LDOs, and SerDesArchitect and integrate ultra-low-power AFEs optimized for battery-operated IIoT and Robotics sensor ASICsDrive full-chip execution in collaboration with internal teams and third-party IP vendors and design housesModeling, Verification & Silicon ExecutionDevelop behavioral and system-level models using MATLAB/Simulink (or equivalent tools) to evaluate noise, linearity, and SNRPerform comprehensive pre-silicon verification across PVT corners using industry-standard simulatorsSupport post-silicon bring-up, characterization, and reliability qualification , including HTOL and burn-inCollaborate with packaging, test, and system teams to ensure successful productizationSystem & Application EnablementSupport multi-modal sensor data acquisition, sensor fusion, and edge AI inference workflowsContribute to hardware–software integration for efficient system-level deploymentPreferred Qualifications:Ph.D. in Electrical Engineering (or related field) with 8+ years of post-degree industrial IC/system design experience ORM.S. in Electrical Engineering (or related field) with 10–12+ years of industrial IC/system design experienceStrong expertise in low-power analog and mixed-signal (AMS) IC designHands-on experience with Cadence Virtuoso, AMS sims, verilog and related analog design toolsProficiency with Spectre, HSPICE , and board-level simulation methodologiesSolid understanding of PDKs, LVS, DRC, and PEX flowsProven experience with ESD and reliability standards (HBM, CDM, TLP)Advanced academic background in Electrical Engineering or a closely related fieldExtensive industry experience in mixed-signal IC and system-level designDemonstrated experience as a Chip Lead, System Architect, or Technical LeadProven ability to drive end-to-end silicon programs from concept to productionStrong capability to work independently and provide technical direction with minimal supervisionExperience with digital design flows , including synthesis and timing analysisFamiliarity with firmware development and software integrationWorking knowledge of embedded interfaces such as I2C, I3C, SPI, and MIPIProficiency in Python or similar scripting languagesExperience with deep submicron CMOS technologies and low-power fabrication processesExposure to IC packaging, board-level validation, and system bring-upBackground in sensor systems, sensor fusion, or edge AI applicationsSoft Skills:Strong technical leadership and ownership mindsetExcellent cross-functional communication and collaboration skillsAbility to mentor and guide engineers across analog, digital, layout, and system domainsStrong analytical and problem-solving abilitiesComfortable making architecture-level decisions under ambiguityEffective at managing external vendors, IP providers, and design partnersResults-driven with a strong focus on execution and qualityQualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail View email address on click.appcast.io or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.Pay range and Other Compensation & Benefits :$192,000.00 - $288,000.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link .If you would like more information about this role, please contact Qualcomm Careers . #J-18808-Ljbffr