Senior Layout Designer (Analog/Mixed Signal)

Mandatory Requirement: 

• 10+ years of industry experience in analog/mixed-signal layout design in advanced process nodes (2nm–16nm, preferably TSMC).
• Proven track record designing layouts for high-speed ADC/DAC and SerDes circuits, with deep understanding of timing, matching, shielding, and electromigration considerations.
• Hands-on experience with Cadence Virtuoso tools (Layout, XL, PVS, Quantus) and solid understanding of schematic-to-layout (S2L) flow.
• Experience with FinFET and/or Gate-All-Around (GAA) process technologies.
• Strong understanding of analog layout techniques: current mirrors, differential pairs, resistors, capacitors, biasing, shielding, guard rings, and ESD structures.
• Experience leading tape-outs, including design documentation, sign-off checks, and cross-team coordination.
• Good communication skills, both written and oral. The ability to articulate their thought process and lead junior members is important.
• This is a senior role. Prior job stability is mandatory - no job hoppers accepted
• Master's in electrical engineering, Computer Engineering, or related field. 

Key Responsibilities:

• Own the physical layout design of high-performance ADC/DAC, SerDes, and analog/mixed-signal circuits across advanced nodes (2nm–16nm).
• Plan, and implement layout design for high-speed, low-noise analog blocks, ensuring signal integrity, matching, symmetry, and optimal parasitics.
• Closely collaborate with circuit designers to achieve aggressive power, performance, and area (PPA) targets, while maintaining design-for-manufacturability (DFM) best practices.
• Work with Cadence Virtuoso and Synopsys Verification tools to perform layout design, verification, and integration.
• Drive floorplanning and analog block partitioning, ensuring effective power grid design, guard ring placement, and substrate isolation techniques.
• Partner with foundry and CAD teams to optimize design flows for TSMC FinFET and Gate-All-Around (GAA) process nodes.
• Conduct LVS, DRC, ERC, and parasitic extraction (PEX) reviews and close layout verification loops.
• Participate in top-level integration and tape-out, ensuring all layout data and GDS handoffs meet signoff requirements.
• Provide technical mentorship to fellow engineers and help define layout design methodologies and automation improvements.

Minimum Qualifications:

• 10+ years of industry experience in analog/mixed-signal layout design in advanced process nodes (2nm–16nm, preferably TSMC).
• Proven track record designing layouts for high-speed ADC/DAC and SerDes circuits, with deep understanding of timing, matching, shielding, and electromigration considerations.
• Hands-on experience with Cadence Virtuoso tools (Layout, XL, PVS, Quantus) and solid understanding of schematic-to-layout (S2L) flow.
• Experience with FinFET and/or Gate-All-Around (GAA) process technologies.
• Strong understanding of analog layout techniques: current mirrors, differential pairs, resistors, capacitors, biasing, shielding, guard rings, and ESD structures.
• Experience leading tape-outs, including design documentation, sign-off checks, and cross-team coordination.
• Strong analytical, problem-solving, and communication skills.
• Self-motivated engineer eager to work in a fast-paced start-up environment, adaptable to evolving project demands.

Preferred Qualifications:

• Familiarity with  Mentor/Siemens Calibre verification tools and scripting (Skill, Python, or Tcl) for layout automation.
• Exposure to  floor planning and top-level chip integration for complex mixed-signal SoCs.
• Experience optimizing for  signal integrity, IR drop, and thermal effects in high-speed designs.