HBM SIPI, Principal Engineer

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of the Heterogeneous Integration Group within Technology and Products, where we build High Bandwidth Memory solutions that power AI and ML platforms. Our team works at the edge of what’s possible, stacking and integrating advanced silicon technologies to deliver industry‑leading bandwidth, density, and power efficiency. We move fast, solve hard problems, and set technical direction others follow! This role sits at the center of next‑generation HBM development. As a senior SI/PI technical authority, you will shape system‑level decisions that directly impact performance, reliability, and scalability across multiple product generations. If you enjoy deep technical ownership, complex problem solving, and influencing architecture from concept to sign‑off, this role offers both challenge and impact. Responsibilities Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency‑ and time‑domain evaluation Define and drive power delivery architecture, impedance targets, and transient analysis Perform electromagnetic extraction and modeling across PCB, package, and interposer designs Establish SI/PI standards, methodologies, and sign‑off criteria for HBM system designs Provide clear technical direction in ambiguous or incomplete design environments Minimum Qualifications 7 years of experience in signal integrity and power integrity modeling and analysis Strong understanding of SI/PI fundamentals, electromagnetics, transmission line theory, and I/O design Hands‑on experience with industry‑standard SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight Preferred Qualifications 10+ years of experience in SI and PDN modeling and analysis Experience with 2.5D/3D advanced packaging technologies such as interposer‑based designs Background working with high‑bandwidth interfaces including HBM, DDR, SERDES, or UCIe Direct ownership of system‑level SI/PI sign‑off for production silicon Scripting experience with TCL and/or Python to automate SI/PI analysis flows The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $175,000.00 – $309,000.00 a year. Additional compensation may include benefits, bonuses and equity. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work, click here: #J-18808-Ljbffr