Staff Engineer - SI/PI for HBM & 2.5D/3D Systems
Micron Technology, Inc
Micron Technology, Inc in Richardson, Texas, is seeking a SI/PI Engineer in HBM Design Architecture to execute high-quality SI/PI analysis for interposers and packages. The role focuses on ensuring outstanding signal quality, power delivery integrity, and interface reliability across multiple HBM product generations. The ideal candidate should have at least 5 years of relevant experience and a deep understanding of SI/PI analysis and circuit simulation tools. Micron offers competitive compensation and robust benefits packages. #J-18808-Ljbffr Micron Technology, Inc
- ...Richardson, TX seeks a Principal Engineer to lead signal integrity... ...integrity initiatives for 2.5D/3D interposers in HBM development. You will... ...concept to sign-off and shape system-level decisions impacting performance... ...PDN design, and define SI/PI standards, collaborating...3D
$121k - $297k
...optimizing High Bandwidth Memory (HBM) solutions for AI and ML... ...workloads. We are seeking a SI/PI Engineer in HBM Build Architecture to... ...design, PDN architecture, and system PI analysis. You will ensure... ...integrity channel analysis for 2.5D and 3D silicon interposer — including...3DFull timeLocal areaImmediate start- Micron Technology is seeking a Principal Engineer for the Heterogeneous Integration Group to lead SI/PI analyses for advanced interposer designs. You will shape power... ...background in high-bandwidth interfaces such as HBM and SERDES. #J-18808-Ljbffr Micron Technology3D
- ...developing High Bandwidth Memory (HBM) solutions for AI and ML... ...Join us as a Senior Verification Engineer and contribute to modular,... ...verification methodologies, and 2.5D & 3D package integration to evaluate... ...co-verification of the overall system and participate in customer...3DLocal areaImmediate start
- ...senior memory interface architect to own HBM IO blocks and subsystems from... ...requirements for advanced heterogeneous systems. Lead cross‑functional teams across front-end, layout, SI/PI, thermal, and packaging to optimize 2.5D/3D memory-interface implementations and drive...3D
- ...This role sits at the center of next‑generation HBM development. As a senior SI/PI technical authority, you will shape system‑level decisions that directly impact... ...Responsibilities:Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency‑ and...3DFull timeLocal areaImmediate start
$175k - $309k
Principal Engineer - Heterogeneous Integration Group Micron Technology... ...channel analysis for 2.5D and 3D silicon interposers, including... ...interposer designs. Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs. Provide clear technical...3DFull timeLocal area- ...developing High Bandwidth Memory (HBM) solutions for AI and ML... ...in the industry.Join us as a Staff Verification Architect and shape... ...closely with Design Engineering, Product Engineering, Business... ...verification methodologies, and 2.5D & 3D package integration to analyze...3DFull timeLocal areaImmediate start
- ...developing High Bandwidth Memory (HBM) solutions for AI and ML... ...in the industry. Join us as a Staff Verification Architect and... ...collaborate closely with Design Engineering, Product Engineering,... ...verification methodologies, and 2.5D & 3D package integration to analyze...3DLocal areaImmediate start
- ...communicate and advance faster than ever.The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test... ...technologies including TSVs, hybrid bonding, and 3D integration.Understanding of reliability...3DFull timeLocal areaImmediate start
- ...faster than ever.Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑... ...and process‑technology impactsExperience in the 3D-IC technology, methodology, and advanced packaging...3DFull timeLocal areaImmediate start
$153k - $296k
## Principal Engineer Signal Integrity Power IntegrityApplylocations... ...technologies and systems that transform... ...:*** **Lead SI/PI strategy** for... ...HFSS, SIwave, Q3D, Synopsys tools, and... ...interposers, chiplets, 2.5D, and 3D... ...including chiplets, UCIe, HBM-based systems, 2.5D...3DLocal area- ...generation High Bandwidth Memory (HBM) solutions for AI, machine... ...experienced HBM Architecture Engineer to define and drive the architecture... ...Verification, Packaging, and System Architecture teams to define... ...technologies, including 2.5D, 3D integration, and TSV-based systems...3DFull timeLocal areaImmediate start
- ...leading High Bandwidth Memory (HBM) solutions for next-generation... ...high-performance computing systems.Micron is seeking an experienced... ...MTS - HBM Thermal Integration Engineer to drive thermal performance optimization... ...semiconductor packaging, 2.5D/3D integration, TSV technologies,...3DFull timeLocal areaImmediate start
$146k - $297k
...advance faster than ever.As an HBM Power Delivery Network (PDN) Engineer, you will be part of the... ....Work with package and system teams to co-optimize die-package... ...based simulation tools and 3D modeling of PDN networks.... ...packaging technologies (e.g., 2.5D/3D integration)....3DFull timeLocal areaImmediate start- ...to:• Own and deliver critical HBM IO blocks and subsystems from... ...supporting future CPO systems.• Define HBM PHY, controller-... ...interface implementation across 2.5D and 3D systems.• Lead root-cause analysis... ...packaging, test, and product engineering teams.• Define and...3DFull timeLocal areaImmediate start
$97k - $205k
...ever.As a Physical Verification Engineer, you will be a key technical... ...verification flows for next‑generation HBM logic die and memory‑centric... ...for advanced‑node system‑on‑chip, memory, or heterogeneous... ...including multi‑die, chiplet, or 2.5D/3D integration.Background in GPU,...3DFull timeLocal areaImmediate start$142.88k - $214.32k
..., TexasX-BAT Division - X-BAT Engineering - Mechanical /Full Time Employee... ...civilians with intelligent systems. Its products include Hivemind... ...YouTube. Job Description: As a Staff (L4) Actuated Systems Engineer... ...PLM: Extensive experience in 3D CAD modeling, mechanical layouts...3DFull timeTemporary workPart timeWorldwide$146k - $247k
...the development of High Bandwidth Memory (HBM) solutions for AI and ML applications.... ...for complex high‑bandwidth memory (HBM) system‑on‑chip (SoC) base‑die designs. Your work... ...signoff.Work with verification, product engineering, test, probe, and manufacturing teams to...Full timeLocal areaImmediate start$146.48k - $219.72k
..., TexasX-BAT Division - X-BAT Engineering - Mechanical /Full Time Employee... ...civilians with intelligent systems. Its products include Hivemind... ...YouTube. Job Description: As a Staff (L4) Aircraft Thermal Systems... ...installations.CAD and PLM: Experience in 3D CAD modeling, thermal hardware...3DFull timeTemporary workPart timeWorldwide$180.8k - $271.2k
..., TexasX-BAT Division - X-BAT Engineering - Mechanical /Full Time Employee... ...civilians with intelligent systems. Its products include Hivemind... ...Job Description: As a Senior Staff (L5) Environmental Control System... ....CAD and PLM: Experience in 3D CAD modeling, routing, and drawing...3DFull timeTemporary workPart timeWorldwide- ...Principal Signal Integrity Engineer — Interface... ...Optimization — Performing SI analysis during... ...enable package and system-level performance scalingLink... ...line theory to SI/PI analysis of... ...electromagnetic field solvers — Q3D, SIWAVE, HFSS, or... ...technologies — 2.5D/3D integration,...3DFull timeLocal areaImmediate start
- ...integration, and execution of next-generation HBM and advanced memory products. The... ...Design, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver... ....Familiarity with package integration, 2.5D/3D stacking, TSV, and advanced packaging technologies...3DFull timeLocal areaImmediate start
- ...optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance... ...computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry... ...Design Engineer - Sustaining (Staff), you will work closely with cross-...Full timeLocal areaImmediate start
- ...advance faster than ever.Job DescriptionThe HBM Architecture team develops advanced... ...design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and... ...Qualifications:Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field...Full timeLocal areaImmediate start
- ...communicate and advance faster than ever.Micron’s HIG HBM Digital Design Group is seeking a Digital Design Engineer to contribute to the architecture, RTL development... ...with verification, physical design, DFT, CAD, and system architecture teams to deliver high‑quality well‑...Full timeLocal areaImmediate start
$146k - $297k
...Job Description The HBM Architecture team develops advanced datapath solutions that... ...design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and... ...~ Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field...Full timeLocal areaRelocation- ...members and civilians with intelligent systems. Its products include Hivemind... .... Job Description: As a Staff (L4) or Senior Staff (L5) Landing Gear Engineer, you will take full technical ownership... ...and PLM: Extensive experience in 3D CAD modeling, mechanism layout, and...3DFull timeTemporary workPart timeWorldwide
$136k - $160k
...Staff Systems Engineer SmithRx is seeking a visionary and highly strategic Staff Systems Engineer to serve as the overarching technical authority... ...scales seamlessly while meeting stringent HIPAA and SOC 2 requirements. What you will do: Serve as the architect...Temporary workFor contractorsWork at officeRemote workFlexible hours- ...optical interface technologies for AI, HBM, and chiplet-based systems.* Define optical interconnect... ...including chiplets, hybrid bonding, 2.5D/3D integration, and heterogeneous integration... ...initiatives across multiple engineering disciplines.**Required Experience***...3D
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