Principal Engineer - HBM Interposer SI/PI & 2.5D/3D
Micron Technology
Micron Technology is seeking a Principal Engineer for the Heterogeneous Integration Group to lead SI/PI analyses for advanced interposer designs. You will shape power delivery strategies, drive impedance targets, and guide electromagnetic modeling across boards, packages, and interposers. The role requires 7+ years of SI/PI experience, with hands-on use of industry EDA tools and a strong background in high-bandwidth interfaces such as HBM and SERDES. #J-18808-Ljbffr Micron Technology
Vacancy posted 1 day ago
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