Staff Hardware Engineer, TPU Interconnect and Packaging

Staff Hardware Engineer, TPU Interconnect and Packaging

Share Staff Hardware Engineer, TPU Interconnect and Packaging

corporate_fare Google place Sunnyvale, CA, USA

In most instances, this position requires in-person interviews as part of the hiring process.

• Bachelor’s degree in Electrical Engineering, Materials Science, Optical Engineering, Microelectronics, a related technical field, or equivalent practical experience.
• 10 years of experience in semiconductor packaging, integration, or interconnect design.
• Experience with interconnect modeling, 2.5D/3D interposer design rules, or chiplet package assembly.

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Optical Science, Materials Science, or a related technical discipline.
• Technical expertise in silicon photonics integration, Co-Packaged Optics (CPO), 2.5D silicon interposers, and high-density substrate routing.
• Deep knowledge of wafer-level packaging (WLP), chiplet interconnect standards, dynamic thermal control, and high-density power delivery networks.
• Demonstrated success in delivering first-of-a-kind optical packaging or heterogeneous 3D integration solutions into production systems.
• Track record of leading complex package development programs for high-performance computing (HPC) or AI accelerator platforms.

About the job

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.

As a Staff Hardware Engineer in the Interconnect and Packaging team, you will serve as a technical lead driving technology roadmaps for Tensor Processing Unit (TPU) interconnects and optical packaging. You will bridge hardware architecture with foundry manufacturing capability, leading cross-functional teams to deliver multi-terabit packaging capabilities.

The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.

We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $192000 - $278000 (USD) + 20% bonus target + equity + benefits

• Define the architectural strategy and package technology selection for next-generation TPU systems, incorporating 2.5D/3D interposers, embedded bridges, and co-packaged optics (CPO) modules.
• Drive electro-optical co-design across silicon photonics dies, laser sources, package substrates, and drive electronics to maximize interconnect bandwidth density and energy efficiency.
• Establish signal integrity, power delivery, thermal management, and mechanical design rules across multi-chiplet heterogeneous assemblies.
• Partner with outsourced semiconductor assembly and test (OSAT) vendors, foundries, and optical component suppliers to co-develop custom substrate processes, sub-micron alignment flows, and optical coupling interfaces.
• Lead full-lifecycle technology qualification from pathfinding and architectural simulation through to mass production readiness, while mentoring engineers, fostering technical excellence, and driving engineering best practices across the organization.

Google is proud to be an equal opportunity and affirmative action employer. We are committed to building a workforce that is representative of the users we serve, creating a culture of belonging, and providing an equal employment opportunity regardless of race, creed, color, religion, gender, sexual orientation, gender identity/expression, national origin, disability, age, genetic information, veteran status, marital status, pregnancy or related condition (including breastfeeding), expecting or parents-to-be, criminal histories consistent with legal requirements, or any other basis protected by law. See also Google's EEO Policy , Know your rights: workplace discrimination is illegal , Belonging at Google , and How we hire .

Google is a global company and, in order to facilitate efficient collaboration and communication globally, English proficiency is a requirement for all roles unless stated otherwise in the job posting.

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Equity is granted exclusively and discretionarily by Alphabet Inc. on the basis of an agreement concluded between you and Alphabet Inc. Alphabet Inc. is your sole contractual partner with respect to equity grants. GSU grants are not guaranteed, are discretionary, are subject to approval by the Alphabet Inc. board of directors or its delegate, the terms of the relevant Alphabet Inc. stock plan, and your grant agreement. They have no impact on statutory payments. Current or past grants do not confer an acquired right.