Eng Sr Prin - Proc

Job Description

This role is responsible for developing, optimizing, and sustaining manufacturing processes including solder paste screen printing, solder paste inspection (SPI), pick-and-place assembly, reflow soldering, automated optical inspection (AOI), X-ray inspection, chip bonding processes.

The Senior Principal Process Engineer will be the SME (subject matter expert) and lead process capability improvements, equipment qualification, statistical process control (SPC) implementation, and manufacturing readiness efforts while supporting New Product Introductions (NPI) and Non-Recurring Engineering (NRE) builds. The position requires strong collaboration with Operations, Quality, Maintenance, Supply Chain, and Program Management teams.
This is a FT onsite position on a 9/80 work schedule with every other Friday off.

Job Duties

• Provide technical leadership and ownership of SMT and advanced microelectronics assembly processes including screen printing, SPI, pick-and-place, reflow, AOI, AXI/X-ray, chip bonding, and underfill processes.
• Develop, optimize, and sustain manufacturing process parameters to ensure high reliability, repeatability, and process capability for aerospace and defense electronics.
• Lead process troubleshooting and root cause analysis for manufacturing defects using structured problem-solving methodologies.
• Implement and maintain Statistical Process Control (SPC) monitoring across critical manufacturing processes to ensure process stability and early detection of variation.
• Support New Product Introduction (NPI) activities including design for manufacturability (DFM) reviews, process development, prototype builds, and production readiness validation.
• Provide engineering support for Non-Recurring Engineering (NRE) builds, including prototype and engineering development builds, new process development, and early manufacturing risk mitigation.
• Lead equipment qualification and process validation activities including installation qualification (IQ), operational qualification (OQ), and performance qualification (PQ).
• Develop and maintain manufacturing documentation, including process specifications, PQP's, validation reports, and engineering procedures.
• Drive continuous improvement initiatives focused on yield improvement, defect reduction, and manufacturing efficiency.
• Generate Basis of Estimates (BOEs).
• Partner with Quality Engineering to ensure compliance with AS9100 quality management requirements and IPC standards.
• Collaborate with Maintenance and Operations teams to improve equipment performance, reliability, and production throughput.
• Provide technical mentorship and guidance to process engineers and technicians.
• Participate in cross-functional reviews with program management, design engineering, and manufacturing teams to support production readiness and manufacturing risk reduction.
• Ensure compliance with safety requirements including LOTO procedures, Job Safety Analysis (JSA), and environmental health and safety standards.
• Support manufacturing readiness for high-reliability aerospace and defense programs.

Key Responsibilities
Manufacturing Process Leadership
Provide technical ownership and oversight of critical assembly processes including:

• Solder Paste Screen Printing
• Solder Paste Inspection (SPI)
• Pick and Place Assembly (Fuji)
• Reflow Soldering
• Automated Optical Inspection (AOI)
• Automated X-ray Inspection (AXI)
• Chip Bonding / Die Attach
• Underfill dispensing and curing processes
• Process Capability & Yield Improvement
• Lead continuous improvement initiatives
• Improve process capability (Cp/Cpk)
• Increase manufacturing yield
• Reduce defects and process variation
• Improve equipment performance and utilization
• Equipment Qualification & Process Validation

Lead validation activities including:

• Equipment, installation and qualification

Reflow thermal profiling

• Inspection program optimization
• Equipment capability studies
• Ensure compliance with IPC standards and AS9100 quality requirements.
• Statistical Process Control (SPC)

Develop and implement SPC strategies to monitor critical process parameters such as:

• solder paste deposition
• placement accuracy
• reflow temperature profiles
• inspection defect trends

About BAE Systems Electronic Systems

BAE Systems, Inc. is the U.S. subsidiary of BAE Systems plc, an international defense, aerospace and security company which delivers a full range of products and services for air, land and naval forces, as well as advanced electronics, security, information technology solutions and customer support services. Improving the future and protecting lives is an ambitious mission, but it's what we do at BAE Systems. Working here means using your passion and ingenuity where it counts - defending national security with breakthrough technology, superior products, and intelligence solutions. As you develop the latest technology and defend national security, you will continually hone your skills on a team-making a big impact on a global scale. At BAE Systems, you'll find a rewarding career that truly makes a difference. Electronic Systems (ES) is the global innovator behind BAE Systems' game-changing defense and commercial electronics. Exploiting every electron, we push the limits of what is possible, giving our customers the edge and our employees opportunities to change the world. Our products and capabilities can be found everywhere - from the depths of the ocean to the far reaches of space. At our core are more than 14,000 highly talented Electronic Systems employees with the brightest minds in the industry, we make an impact - for our customers and the communities we serve.

This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.

Required Skills and Education

Bachelor's degree in engineering (Manufacturing, Mechanical, Electrical, or related field)
8+ years of experience in electronics manufacturing or advanced assembly processes
Strong experience with Surface Mount Technology (SMT) manufacturing processes and Circuit Card Assembly (CCA)
Must be able to obtain a secret clearance

Preferred Skills and Education

10+ years of experience in electronics manufacturing or advanced assembly processes
Strong experience with Surface Mount Technology (SMT) manufacturing processes and Circuit Card Assembly (CCA). Experience leading high performing teams.

Benefits Information

Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20+ hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.

Intern Benefits: Temporary employees generally are not eligible for BAE Systems benefits, but can elect to participate in the 401(k) savings plan. Temporary employees working 20+ hours per week are eligible for medical benefits, the employee assistance program, and business travel accident insurance.

Please note: Some benefits may be different for union employees that are governed by a collective bargaining agreement (CBA) or for positions covered by a wage law called the McNamara-O'Hara Service Contract Act (SCA).