Senior RF & Microelectronics Packaging Engineer
$153.5k - $242.5kViasat
A leading communications technology company located in Tempe, Arizona is seeking a Packaging Engineer to manage all aspects of packaging development for RF communication devices. This role requires over 10 years of semiconductor packaging experience, understanding of micro-electronic structures, and strong collaboration skills. The successful candidate will work closely with teams to ensure package reliability and will handle high-level documentation. A bachelor's degree in a relevant engineering field is essential. Competitive salary range from $153,500 to $242,500 per year, dependent on experience. #J-18808-Ljbffr Viasat
Vacancy posted 2 days ago
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