Senior IC Packaging Design Engineer - Xpedition Expert
Stellent IT LLC
Stellent IT LLC is seeking an experienced IC Packaging Design Engineer for a role based in Chandler, AZ, or Hillsboro, OR. The ideal candidate should have 10+ years of senior-level experience, or 4–6 years with a Master's degree in IC packaging and design. Responsibilities include contributing to new product development and ensuring designs meet performance standards. Candidates must demonstrate hands-on proficiency with Siemens Xpedition or Cadence Allegro. #J-18808-Ljbffr Stellent IT LLC
Vacancy posted 19 hours ago
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