IC Packaging Design Engineer
Stellent IT LLC
Location : Chandler, AZ (primary) or Hillsboro, OR (secondary) Experience Tier: Senior-level (primary); Mid-level (secondary) Senior-Level: ~10+ years in IC packaging / package design Mid-Level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design IC Packaging Design Engineer Skills Required This client is looking for a high level IC Package Design Engineer to help with a new product. Bachelor's or Master's degree in Electrical / Electronics Engineering is required. Experience Strong hands‑on experience in Siemens (Mentor) Xpedition (XPD); alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP) Candidates should have experience in the below domains: Physical Design & Layout Substrate design and layout Design for performance, manufacturability, yield, and reliability #J-18808-Ljbffr Stellent IT LLC
Vacancy posted 17 hours ago
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