Process Integration Engineer

Job Title: Principal FEOL Technology Development Engineer – Process Integration Description & Requirements This position is onsite in Bloomington, MN Ability and willingness to relocate to the Bloomington, Minnesota area. (relocation assistance available.) KORE1, a nationwide provider of staffing and recruiting solutions, is seeking a Principal FEOL Technology Development Engineer for a leading U.S.-based semiconductor foundry in Bloomington, Minnesota. (Relocation assistant available) This senior-level role will focus on the development, transfer, optimization, and integration of front-end-of-line semiconductor technologies, including Power Trench MOSFET and BCD/BCDMOS device platforms. We are seeking a true process integration engineer who understands semiconductor fabrication at the device/transistor level and can bring multiple process modules together into a complete, manufacturable technology. The successful candidate will understand not only individual processes such as diffusion, etch, lithography, epitaxy, and thin films, but also how those processes interact to influence device physics, electrical characteristics, yield, reliability, and overall technology performance. The position offers substantial technical ownership and the opportunity to mentor junior engineers while collaborating directly with process, device, manufacturing, and operations engineering teams. Key Responsibilities Lead and contribute to the development, transfer, optimization, and documentation of FEOL semiconductor process flows. Integrate individual process modules into complete process flows capable of meeting electrical, reliability, yield, and manufacturability targets. Design and execute experiments to determine optimal process sequences and parameters. Analyze electrical test, in-process measurement, inspection, cross-sectional, and characterization data to identify process-integration issues and optimization opportunities. Partner with Process Engineering teams across key FEOL modules including silicon/epitaxy, diffusion, etch, lithography, and thin films. Support initial test-chip and technology-transfer lots, identify integration challenges, and drive corrective actions toward successful manufacturing introduction. Work closely with Device Engineering to translate device performance requirements into process specifications and integration strategies. Provide input into process design rules and recommend test structures used to characterize new processes and device behavior. Evaluate new semiconductor technologies and technology-transfer opportunities. Interpret failure-analysis results and investigate relationships between process conditions and electrical/device performance. Provide technical leadership across cross-functional engineering teams. Mentor and provide technical guidance to junior engineers. Communicate development progress, technical findings, risks, and recommendations to senior management and external customers. Required Qualifications Significant semiconductor industry experience with a strong background in FEOL technology/process integration. Experience working at the device/transistor level and integrating multiple semiconductor process modules into complete manufacturing flows. Strong knowledge of silicon semiconductor device physics. Broad working knowledge of key FEOL semiconductor processes such as epitaxy, diffusion, etch, lithography, thin films, and related modules. Demonstrated experience designing or optimizing semiconductor process flows to achieve electrical and manufacturability targets. Experience interpreting electrical test data and correlating device performance with process and physical characterization data. Strong understanding of semiconductor process-engineering fundamentals, equipment capabilities, and the impact of process conditions on device performance. Strong cross-functional collaboration, technical leadership, troubleshooting, and communication skills. Degree in Electrical Engineering, Physics, Materials Science, or a closely related technical discipline. Ability and willingness to relocate to the Bloomington, Minnesota area. (Relocation assistance provided) Preferred Qualifications Process integration experience with Power MOSFET, BCD/BCDMOS, CMOS, IGBT, or other discrete/power semiconductor technologies. Experience across multiple semiconductor technology platforms. Experience with electrical characterization, yield analysis, or failure-analysis techniques. Experience with process/device simulation or TCAD. Experience with Design of Experiments (DOE) and data-analysis tools such as JMP or Spotfire. Knowledge of contact/metallization, backend semiconductor processing, power packaging, assembly, and/or reliability. Previous experience mentoring or technically leading junior engineers. Why Join? This position provides an opportunity to take broad ownership of semiconductor technology development rather than focusing exclusively on a single process module. You will work directly across process, device, integration, manufacturing, and operations engineering disciplines and have meaningful influence over how technologies are developed, optimized, transferred, and ultimately brought into production. The organization is expanding its technology portfolio and customer base, creating an environment where experienced integration engineers can have significant visibility and technical impact while also helping develop the next generation of engineering talent. Compensation : The estimated base salary range is $125,000–$165,000, depending on experience, education, skills, and overall qualifications. Additional compensation may include an annual bonus. Benefits include medical, dental, vision, disability and life insurance, 401(k) with company match, paid time off, annual bonus eligibility, and tuition reimbursement. #J-18808-Ljbffr