Senior 3D Stacked Memory Architect - Lead Innovation
Micron Technology
Micron Technology in the United States seeks a Senior Memory Architect to define 3D stacked memory architectures that span die, stack, packaging and system. You will lead through technical depth, guide major architectural decisions and translate bold ideas into production reality. The role requires a strong background in stacked memory, high-speed I/O and memory system design, with leadership experience across engineering teams and collaboration with customers and platform partners. #J-18808-Ljbffr Micron Technology
Vacancy posted 8 hours ago
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