Microelectronics Bonder - High-Precision Wire Bonding
Lockheed Martin
Lockheed Martin Missiles & Fire Control seeks a Microelectronic Bonder in Chelmsford, MA. You will perform high‑precision wire‑bonding and hybrid circuit fabrication, including aluminum and gold wirebonding on very small pads and dense chip layouts. You will troubleshoot defective hybrids, assemble substrates in special packages, and solder coils to complete sub‑assemblies. U.S. citizenship and Secret clearance are required. #J-18808-Ljbffr Lockheed Martin
Vacancy posted 2 days ago
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