Microelectronic Bonder: Precision Wire Bonding & Hybrids
Lehigh Heavy Forge Corporation
Lockheed Martin Missiles & Fire Control in Chelmsford, MA seeks a Microelectronic Bonder to perform high-precision wire-bonding and hybrid circuit fabrication, supporting mission-critical defense systems. Qualifications include a high school diploma or GED and the ability to obtain a Secret clearance (U.S. citizenship required). Familiarity with bonding and ESD procedures is preferred. This is a full-time role on-site in Chelmsford. #J-18808-Ljbffr Lehigh Heavy Forge Corporation
Vacancy posted 4 days ago
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