Lead Wafer Bonding & Advanced Packaging Architect
thrively
Thrively is seeking a Principal Wafer Bonding Integration & Packaging Engineer to own bonding integration, packaging development, and manufacturing transfer. You will collaborate across design, process development, and external foundries to enable scalable production of advanced semiconductor technologies. The role demands deep expertise in wafer bonding technologies, process integration, and a product mindset to ensure manufacturability, reliability, and repeatable yields in high-performance AI #J-18808-Ljbffr thrively
Vacancy posted 2 days ago
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