Global NPI & Advanced Packaging Lead (EMIB/3D)
$180k - $301kMediaTek
MediaTek Research Lab Inc. is seeking a skilled Package Development/NPI Engineer in San Jose, California, to drive advanced packaging technologies from development to mass production. This role involves collaboration with internal teams and external partners to ensure successful implementation and quality management of new products.
The ideal candidate has over 8 years of experience in package development within the semiconductor industry, with expertise in advanced packaging technologies. A salary range of $180,000 to $301,000 is offered, along with performance bonuses and comprehensive benefits.
#J-18808-Ljbffr$220.92k - $311.89k
...Computing Lab-together with a global ecosystem of 250+ research... ...seeking a front-end silicon lead to manage both the design and... ...especially AI.• Experience with advanced packaging and heterogeneous integration... ...(e.g., chiplets, UCIe, 2.5D/3D).• Experience with asynchronous...3DFull timeLocal areaImmediate startShift work- ...We are looking for a senior SoC Chip Lead to join our San Jose office. Key Responsibilities... ...with FPGA and ASSPs utilizing 2.5D/3D advanced packaging technologies and chiplet-based... ...behind success in a highly competitive, global industry. Lattice continually strives...3DWork experience placementWork at officeWorldwide
$117.8k - $172.8k
...semiconductors, wafers, reticles, advanced packaging, process equipment and... ...delivers industry-leading metrology solutions... ...Product Introduction (NPI) product development... ...plus.Familiarity with 3D CAD software,... ...effectively coordinate with a globally distributed team....3DMinimum wageFull timeWork experience placement$181k - $265.47k
...will play a key part in advancing business priorities... ...decisions across NPI, Sustaining, Tech Support... ...trends — advanced packaging, hybrid bonding, 3D NAND scaling, EUV/High... ...Willingness to travel — 25-40% global ~ Minimum... ...proven track record to lead including 4+ years of...3DMinimum wageLocal area$148.5k - $193.3k
...Impact As the Silicon NPI Business Process... ...wafer starts, OSAT packaging substrates, probe,... ...Establish and track leading and lagging operational... ...decision rights.· Global Sourcing & Supplier... ...Power BI, Tableau, Advanced Excel, SQL, or... ...packaging (e.g., 2.5D/3D, CoWoS, chiplets),...3DFull timeTemporary workLocal areaFlexible hoursAfternoon shift$180k - $272k
Advanced Packaging TechnologistCategoryProcess Technology DevelopmentLocationSan... ..., specifically 2.5D/3D. This role involves close collaboration... ...but not limited to CoWoS, EMIB, SoIC, HBM, FCBGA, and HBPOP.... ...system-level requirements• Lead and coordinate projects across...3DTemporary work$161k - $221k
...AreApplied Materials is a global leader in materials... ...virtually every new chip and advanced display in the world.... ...day in a supportive leading global company. Visit our... ...to develop advanced packaging solutions for next-generation... ..., hybrid bonding, 2.5D/3D heterogeneous...3DFull time- Phizenix Inc. seeks an Advanced 2.5D/3D/Chiplet packaging Lead to direct Signal Integrity for package, PCB and system design for copper interconnects beyond 200G. Lead 2.5D/3D and heterogeneous packaging development for co-packaged driver, TIA and optical engines, including...3D
- ...Micron Technology, Inc. is seeking a Sr. Director of Semiconductor Sourcing and NPI Procurement to lead global strategy, sourcing, and supplier ecosystems for wafer foundry, IP/EDA, and NAND controller categories, with accountability for cost competitiveness and supply...
- ...Inc. in Santa Clara, CA is seeking an IC Packaging Engineer to lead packaging technology development for SoC projects, including 2.5D/3D packaging, and to drive integration across... ...new materials and packaging specs for advanced products. #J-18808-Ljbffr Apple Inc.3D
$200.55k - $322.25k
...MediaTek Research Lab Inc. is seeking a visionary manager or director for Advanced Packaging Development in San Jose, California. In this key role, you will lead the development of cutting-edge 2.5D and 3D packaging solutions for various business units. Responsibilities...3D$138.5k - $235.5k
Company OverviewKLA is a global leader in diversified... ..., integrated circuits, packaging, printed circuit boards... ...ideas and devices that are advancing humanity all begin with... ...with the world’s leading technology providers to... ...technologies including 2.5D/3D packaging, chiplets,...3DMinimum wageFull timeWork experience placementFlexible hours- AMD in Santa Clara, CA seeks a strategic Director, Proprietary Events to lead Advancing AI, AMD's global flagship conference, and oversee a broader portfolio of proprietary events. This role owns annual strategy, planning, execution, and performance, and partners with Global...
$194.6k - $285.7k
...Optics Operations, you will lead and mentor a team of... ...teams (design, foundry, IC packaging, test, reliability) to exceed... ...wafer sort/probe testing, and advanced packaging (2.5D/3D, flip-chip, optical interconnect... ...big things happen on a global scale. Because our solutions...3DFull timeTemporary workLocal areaFlexible hours$138.5k - $235.5k
Company Overview KLA is a global leader in diversified... ..., integrated circuits, packaging, printed circuit boards... ...and devices that are advancing humanity all begin with... ...together with the world’s leading technology providers to... ...including 2.5D/3D packaging, chiplets, heterogeneous...3DMinimum wageWork experience placementFlexible hours$180k - $301k
Package Development/NPI EngineerCategoryProcess Technology DevelopmentLocationSan... ...Engineer who will drive advanced package technologies from initial... ...and Responsibilities:• Lead the transition of advanced... ...technologies such as EMIB, 2.5D/3D/3.5D, FCBGA, HBM integration...3DTemporary work- ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD... ...breakthroughs, or bringing leading edge products to... ...Senior Director of Packaging Engineering to lead... ...leading large global teams and influencing... ...introduction (NPI) and high-volume manufacturing... ...(SiP), 2.5D/3D integration, or...3D
$190k - $270k
Sr. Staff/Principal Advanced Packaging ArchitectCategoryAlgorithm & ArchitectureLocationSan Jose, CAExperienceMore... ...love to hear from you. Responsibilities:Lead research and development of package... ...packaging solutions such as 2.5D/3D, CPO, IVR, and HSIO. Partner across...3DTemporary work$188k - $356k
Optical 3D Packaging TechnologistCategoryProcess Technology DevelopmentLocationSan Jose, CAExperienceMore... ...experienced technologist to join our global advanced packaging team. You will be a key... ..., New Product Introduction (NPI) and HVM. Main Requirements and Qualifications...3DTemporary work$332k
...on the world.NVIDIA’s advanced datacenter boards push forward chip packaging, PCB fabrication, SMT,... ...an early stage.Build, lead, and develop a global Board PDE organization... ...products from design through NPI to high-volume... ...fine-pitch BGA, 2.5D/3D packaging — taken through...3DPermanent employmentFull time$2,500 per month
...tier investors and staffed by leading engineers, Etched is redefining... ...platform across silicon, package, and board. The ideal candidate... ...-speed signaling solutions in advanced packaging. You will work closely... ...and optimization within 2D/2.5D/3D packages Close...3DWork at officeRelocation package$115.2k - $172.8k
...process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip... ...defect inspection of wafers and packages; metal interconnect... ...analytics; and lithography for advanced semiconductor packaging....3DPermanent employmentFull time- ...closely with silicon & package design, marketing, NPI, assembly/substrate... ...effective high performance, advanced custom package... ...requirements. •2.5D & 3D is cutting edge... ...towards unified solution. -Lead in identification,... ...customers in various global locations and may require...3DFull timeLocal areaFlexible hours
- Apple Inc. is seeking an Engineering Program Manager for Wireless Regulation in Cupertino. You will lead global wireless certifications, manage issues and resources for New Product Introduction, and collaborate across engineering and policy teams to navigate regulatory...
- Applied Materials, a global leader in materials science and engineering, seeks an experienced project professional in the semiconductor space. The role involves planning, execution, and cross‑functional coordination across internal teams and external vendors to deliver...
$232.65k - $348.5k
...to thrive, learn, and lead. Your Team, Your ImpactMarvell... ...is scaling fast. Advanced-node wafer demand is... ...24 to 12 months, so NPI and production ramps overlap... ...first-of-a-kind: new packaging (2.5D/3D, CoWoS, MCM), long... ...function.Experience leading global teams across time...3DPermanent employmentFull timeInternshipWork from home$199.3k - $348.8k
Company OverviewKLA is a global leader in... ...integrated circuits, packaging, printed circuit boards... ...devices that are advancing humanity all begin... ...together with the world’s leading technology... ...Logic/Foundry, DRAM, 3D NAND, and advanced... ...product introduction (NPI), including beta...3DMinimum wageFull timeWorldwideFlexible hours$167.5k - $268k
...Modeling Architect to lead a technical team in... ...transmitter, receiver, package, channel, clocking,... ...communication. Expertise in advanced packaging including silicon interposers, EMIB, hybrid bonding, and 3D integration.... ...in Broadcom! We are a global technology leader...3DLocal area$20 - $47 per hour
MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products... ...circuit design, advanced packaging, systems architecture... .../or highest data rates. Leading technologies, innovative... ...to setup and execute. 3D printing and modeling capabilities...3DHourly payWork experience placementInternship$150.98k - $218.62k
...Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that... ...and the world, and help drive advancements in automation and robotics,... ...Project / Program Manager to lead cross-functional development... ...lifecycles, silicon development, packaging, qualification, and...Permanent employmentFull timeWork at officeDay shift
Do you want to receive more vacancies?
Subscribe and receive similar vacancies to Global NPI & Advanced Packaging Lead (EMIB/3D). Be the first to apply!


