HVM Process Manager (Boise)

Process Engineering Manager – Semiconductor Equipment (HVM)

Boise, Idaho | Onsite

Kokusai Electric is a global technology leader in vertical diffusion furnace systems, enabling advanced semiconductor manufacturing at scale. We partner closely with the world’s most demanding logic and memory fabs, supporting both development and high‑volume manufacturing (HVM) across critical process modules.

We are hiring a Process Engineering Manager to lead HVM process support for one of the industry’s most advanced and successful memory customers. This role sits at the intersection of process technology, fleet performance, customer escalation management, and people leadership —with real ownership and visibility.

If you thrive in high‑volume manufacturing environments , enjoy building technically strong teams, and want to be accountable for process stability, defectivity reduction, and sustained tool performance , this is a rare opportunity.

Why This Role Matters

• You will own fleet‑wide process performance for critical deposition technologies in a live HVM environment.
• You will lead the front line of customer engagement for process escalations, stability, and ramp.
• You will build and develop a high‑caliber process engineering team supporting both development and manufacturing.
• Your work directly impacts yield, uptime, and customer confidence at scale.

What You’ll Own

• Lead a team responsible for sustaining process performance within customer specifications , using SPC, trend analysis, and structured problem‑solving methodologies.
• Drive data‑driven process ramp from development into high‑volume manufacturing.
• Own investigation and resolution of process‑related defects , including escalation management, root cause analysis, and corrective action implementation.
• Serve as the management‑level interface for customer escalations related to process performance, defectivity, and line stability.
• Direct process engineering support to maintain stable manufacturing lines within control limits .
• Review and approve new or modified process recipes, formulations, and improvements aligned to customer and product needs.
• Partner with internal engineering and scientific teams to define equipment, handling, and process requirements .
• Lead evaluation of process test data, material/process limits, and key variables to drive repeatable, stable outcomes.
• Oversee NPI and process implementation at customer development and HVM sites.
• Provide senior technical guidance on particle trends, film trends, process fingerprints, metrology interpretation, and recipe troubleshooting .
• Translate customer development needs into engineering priorities and roadmap recommendations .

People & Leadership Responsibilities

• Manage, coach, and develop a team of process engineers delivering high‑quality technical support.
• Set priorities and allocate resources across customer support, development work, and escalation response .
• Establish clear goals, operating rhythms, and performance expectations.
• Build a culture of technical rigor, accountability, and proactive problem solving .
• Ensure clear, effective communication with customers and internal stakeholders through reports, presentations, and technical reviews.

Experience

Required

• Bachelor’s degree in Physics, Chemistry, Materials Science, Semiconductor Manufacturing , or a related technical discipline (or equivalent experience).
• 7+ years of semiconductor process or equipment engineering experience, including hands‑on support in HVM or customer production environments.
• 3+ years of people leadership or engineering management experience, including team development, work prioritization, and coaching.
• Strong working knowledge of one or more of the following process domains: LP‑CVD, ALD, and/or plasma‑enhanced processes .
• Demonstrated experience in process recipe creation, modification, optimization, and troubleshooting .
• Strong & Solid understanding of semiconductor metrology, process data analysis, particle trend analysis, and film trend analysis .
• Experience supporting or leading new product introduction (NPI) and implementation in semiconductor manufacturing environments.

Additional Details

• Location: Boise, ID (Onsite)
• Travel: ~10%
• Relocation: Eligible
• Compensation: $140,000 – $190,000 base salary (depending on experience), plus comprehensive benefits and additional compensation eligibility

Kokusai is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

To apply, please send your resume to View email address on apply.placed-app.com and indicate RQ #1083