Sr. Module Engineer, Hybrid Bonding

Who We AreApplied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. What We OfferSalary:$147,000.00 - $202,500.00Location:Santa Clara,CAYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects. PositionSummaryWeareseekingahighlymotivatedDie-to-WaferHybridBondingModuleEngineertodevelopandscalenext-generationhybridbondingtechnologiesforadvancedsemiconductorpackagingapplicationsincluding Memory,chiplets,AIaccelerators,photonics,andheterogeneousintegrationplatforms.The successful candidate will lead process module development across die preparation, surface activation, die placement, hybrid bonding, post-bond characterization, yield improvement,andmanufacturingscale-up.Thisrolerequiresclosecollaborationwithequipmentdevelopmentteams,processintegrationengineers,materialsscientists,devicearchitects,andexternalecosystempartners.The position is ideal for candidates passionate about enabling future high-bandwidth and energy-efficient computingsystemsthroughadvancedinterconnecttechnologies.Hybridbondingtechnologiesincludingcopper-copperanddielectric-dielectricdirectbondingarecriticalenablersfornext-generation3DintegrationandHBMstacking.KeyResponsibilitiesHybridBondingProcessDevelopmentDevelopandoptimizedie-to-wafer(D2W)hybridbondingprocessesforadvancedpackagingapplications.Establishprocesswindowsfor:SurfacepreparationPlasmaactivationDieplacementAlignmentandoverlaycontrolBondingtemperatureandpressureoptimizationPost-bondannealingDriveCu-Cuanddielectric-dielectricinterconnectformationwithfocusonelectricalperformanceandreliability.ProcessIntegrationSupportintegrationofhybridbondinginto:Memory architecturesChiplet-basedsystemsSiliconinterposersSystem-on-WaferplatformsCo-packagedoptics(CPO)Collaboratewithintegrationteamstoresolveprocessinteractionsandyieldexcursions.YieldandDefectReductionIdentifyrootcausesof:BondvoidsDieshiftOverlayerrorsNon-uniformbondingParticlecontaminationUtilizeDOEmethodologiesandstatisticalprocesscontroltoimproveyieldandprocessrobustness.MetrologyandCharacterizationDrivebondingqualitycharacterizationusing:CSAMX-rayinspectionFIB/SEMAFMOpticalmetrologyElectricalteststructuresDevelopcorrelationbetweenprocessparametersandpackageperformance.EquipmentandTechnologyDevelopmentWorkcloselywithequipmentengineeringteamson:HybridbondingsystemsDieplacementtoolsPlasmaactivationmodulesSurfacepreparationmodulesIntegratedprocesscontrolsolutionsParticipateinevaluationandqualificationofnext-generationbondingplatforms.ReliabilityEngineeringDefineandexecutereliabilitytestplans:ThermalcyclingHTOLMechanicalpull/sheartestingMoisturesensitivityevaluationsDrivefailureanalysisandcorrectiveactions.TechnicalLeadershipLeadcross-functionalprojectsfromconceptthroughtechnologytransfer.Publishtechnicalresultsinternallyandexternally.Presentdevelopmentprogresstoengineeringleadershipandcustomers.Mentorjuniorengineersandresearchers.MinimumQualificationsEducationM.S.in:MaterialsScienceElectricalEngineeringMechanicalEngineeringChemicalEngineeringPhysicsSemiconductorManufacturingORPh.D.inoneoftheabovedisciplinesExperienceMinimum5+yearsofsemiconductorprocessdevelopmentexperienceaftergraduatedegree.Directexperienceinatleastoneofthefollowing:HybridbondingThermocompressionbondingWaferbondingAdvancedpackagingHBM developmentCuinterconnecttechnologyChipletintegrationTechnicalSkillsStrongunderstandingof:Cu-CuinterconnectformationSurfacechemistryandplasmaactivationCMPandplanarizationDefectengineeringSemiconductorprocessintegrationStatisticalprocessanalysisExperiencewithDOEandJMP/Minitabanalysistools.Familiaritywithmetrologyandfailureanalysistechniques.PreferredQualificationsPh.D.with5+yearsindustryexperience.ExperienceinHBMor3Dstackingtechnologies.Experiencewith:HybridbondingequipmentdevelopmentDirectbondinginterconnect(DBI)DieplacementsystemsAdvancedpackagingprocessintegrationKnowledgeofAI/HPCpackagingarchitectures.Experienceworkingwith200mmand300mmwafermanufacturingenvironments.Trackrecordofpatents,publications,orconferencepresentations(ECTC,IEEE,IMAPS,SEMI,etc.).DesiredPersonalAttributesStrongtechnicalleadership.Excellentproblem-solvingskills.Hands-onlaboratorymindset.AbilitytodrivetechnologyfromR&Dintomanufacturing.Effectivecommunicatoracrossengineering,operations,andcustomer-facingteams.Passionforenablingnext-generationAIandhigh-performancecomputingplatforms.Additional InformationTime Type:Full timeEmployee Type:Assignee / RegularTravel:Yes, 10% of the TimeRelocation Eligible:YesThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at View email address on click.appcast.io, or by calling our HR Direct Help Line at View phone number on click.appcast.io, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.SummaryLocation: Santa Clara,CAType: Full time