Senior Systems Engineer Co-Packaged Optics

Title Senior Systems Engineer Co-Packaged Optics Location New York, NY, US; Charlotte, NC, US, 28216; North Carolina, NC, US Company Corning Scope of Position The Senior Systems Engineer is responsible for working directly with customers and ecosystem partners to understand product challenges, create system-level solutions, translate those solutions into product requirements, and drive design-in of Corning's Co-Packaged Optics (CPO) products. The role combines deep technical expertise in semiconductor manufacturing and photonic connectivity with a strong customer-facing orientation, serving as the technical interface between Corning R&D, program management and the business team to shape the future of AI infrastructure in hyperscale data centers. Roles and Responsibilities Serve as a primary technical point of contact for strategic customers and ecosystem partners throughout the CPO product lifecycle. Lead product and system ideation with customers and partners to address identified needs through differentiated product offerings. Translate customer requirements into internal product specifications, ensuring alignment between external needs and Corning's R&D and product development capabilities. Conduct feasibility studies and develop initial design concepts to be transferred to R&D. Establish ongoing and trusting relationships with technical counterparts amongst primary customers and partners in the CPO ecosystem. Develop a deep understanding of customer applications, the systems in which they operate, and how Corning products function in these applications. Lead technical deep-dive sessions, architecture workshops, and design reviews with customer engineering teams, including hyperscaler network architects and ASIC/platform engineers. Perform system-level thermo-mechanical simulations to provide design recommendations. Deliver compelling technical presentations, demos, and proof-of-concept (PoC) engagements. Participate in mapping out market trends and technology roadmaps, identifying key gaps and recommendations in terms of both technology capabilities and new products. Collaborate with PLM and Marketing to refine Corning's value proposition in the context of a deep understanding of the applications and use cases of our CPO solutions. Collaborate with ASIC partners, packaging houses, laser vendors, and connector suppliers as well as hardware providers to build understanding of next generation requirements. Act as the voice of the customer inside Corning, driving requirement clarity, feature prioritization, and responsiveness to field feedback. Required Education Bachelor's Degree in Engineering, Applied Science, or equivalent fields. 7+ years of experience in an applications, systems, or product development function, with meaningful time in a customer-facing technical role. Participation in complex projects and contribution to multi-functional teams in a fast-paced competitive environment. Deep understanding of optics, glass as a material, optical fiber and communications, Silicon Photonics, semiconductor packaging, semiconductor metrology, electronic hardware design and manufacturing. Ease with frequent customer engagements at a technical level, ability to comprehend technical needs and convey effective value propositions. Ability to collaborate across functional and geographical boundaries to solve problems and develop solutions. Conceptualize complex specification and application requirements and articulate to internal/external stakeholders to initiate new product development or implement product changes. Mobilize and influence people within and outside the organization to meet objectives. Garner trust and lead collaborative work efforts, both internally and externally, across multiple time zones. Desired Experience Master's or Doctorate Degree in Engineering, Applied Science, or equivalent fields. Work experience in PLM, Manufacturing, Systems Engineering, and/or Product Development in a fast-paced OEM context. Systems-level knowledge of CPO architectures, including photonic engines, external laser sources, fiber attach, ASIC integration and advanced packaging. Direct experience deploying CPO, NPO, LPO, or advanced pluggable optics in production or pre-production environments. Familiarity with AI/ML fabric architectures (scale-up / scale-out), including GPU/XPU cluster designs and optical I/O requirements. Immigration Sponsorship This position does not support immigration sponsorship. Compensation Range for this position is $112,902.00 - $155,240.00, assuming full-time status. Starting pay for the successful applicant is dependent on a variety of job-related factors. Benefits Company-wide bonuses and long-term incentives. 100% company-paid pension benefit with fixed contributions that grow throughout your career. Matching contributions to your 401(k) savings plan, total contributions up to 7-12% of pay. Health and well-being benefits including medical, dental, vision, paid parental leave, family building support, fitness, life insurance, disability and disease management programs. Paid time off and Employee Assistance Program. Recognition program to celebrate successes and reward colleagues. Equal Employment Opportunity We prohibit discrimination on the basis of race, color, gender, age, religion, national origin, sexual orientation, gender identity or expression, disability, veteran status or any other legally protected status. Corning is committed to providing equal employment opportunities and considers requests for reasonable accommodations in accordance with applicable laws. Individuals with disabilities or sincerely held religious beliefs may request reasonable accommodations to participate in the application or interview process, perform essential job functions, or access other benefits and privileges of employment. To submit a request for reasonable accommodation related to disability or religion, please contact us at. #J-18808-Ljbffr Corning Incorporated