Packaging SIPI Engineer, Principal Engineer

Company

Qualcomm Technologies, Inc.

Job Area

Engineering Group, Engineering Group > Packaging Engineering

General Summary

The candidate will work in a collaborative engineering environment, performing signal and power integrity tasks while partnering with package, platform and IC designers to optimize package and system designs. Primary responsibilities include electrical model extraction, signal and power integrity simulations, and clear reporting of results. This role requires effective collaboration with board, package, and IC design teams across organizational boundaries. The candidate will support high-speed SerDes electrical model extraction and system-level simulation for high-speed computing and server projects.

Responsibilities

• Perform IO analysis using established methodologies, including model extraction, simulation, and reporting. IO types include various serial interfaces.
• Analyze IO power distribution for product development and reference systems using established methodologies.
• Perform package extraction for time- and frequency-domain analysis and provide package design guidelines.
• Document results clearly and thoroughly.

Minimum Qualifications

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.

Preferred Qualifications

• 10+ years of experience with high-speed SerDes package, PCB, or system design for computing/server standards.
• Strong background in electromagnetics, transmission line theory, and crosstalk.
• Proficiency with field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity, as well as SPICE transient simulation tools such as ADS and HSPICE, including IBIS and IBIS-AMI models.
• Experience with SerDes specifications such as PCIe, USB, UFS, and MIPI.
• Experience using MATLAB to automate simulation workflows.
• Experience with programming languages such as C/C++ or scripting languages such as Perl/Python is a plus.
• Master’s or Ph.D. degree with 10+ years of industry experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail View email address on click.appcast.io or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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Pay range and Other Compensation & Benefits

$201,600.00 - $302,400.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.