Director, IC Packaging Engineering - Mechanical Simulation

General Summary

This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization and represents a senior leadership role within the Mechanical Simulation function. The Director will lead a team of engineers responsible for delivering FEA-based mechanical simulation solutions in support of Qualcomm's current and next-generation chipsets and advanced packaging technologies.

Core Technical Responsibilities

The Director will drive strategic alignment across IC package design/architecture, New Product Introduction (NPI), assembly, and Chip-Package Interaction (CPI) teams, ensuring high-quality mechanical simulation support across High Volume Manufacturing (HVM) and advanced packaging programs. Key responsibilities include:

• Overseeing the development and validation of mechanical FEA models (ANSYS APDL).
• Establishing BKM methodology for test correlation and material characterization.
• Guiding stress/mechanical analysis for IC package designs, including warpage, solder joint reliability (SJR), package assembly process simulation, board level reliability (BLR), and chip-package-board interaction.
• Championing innovation in simulation workflows, automation, and tooling to improve team efficiency and scalability.
• Leading strategic initiatives to advance simulation methodology and best practices across cross-functional teams.

Minimum Qualifications

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.

Preferred Qualifications

• Ph.D. in Mechanical Engineering, Materials Science, Electrical/Microelectronics Engineering, or related field.
• 12+ years of combined experience in finite element modeling and analysis for IC electronic packaging and interconnects.
• 5+ years of direct people management, with experience managing managers or senior technical staff.
• Proven track record of building and scaling high-performing simulation or engineering teams.
• Deep expertise in IC electronic packaging structures, assembly processes, reliability testing and analysis, CPI, package-board interaction, and DOE.
• Strong background in electronic packaging materials and thermo-mechanical behavior.
• Experience establishing simulation BKMs, methodologies, and automation frameworks (e.g., APDL macros, OptiSLang, scripting/automation pipelines).
• Experience with material testing for strength and fracture, including designing and executing mechanical test methods.
• Demonstrated experience presenting technical roadmaps and simulation strategies to executive and customer audiences.
• Publications or patents in FEA predictive modeling, warpage/SJR, and/or interfacial fracture testing (plus).
• Experience working with external customers or partners in a technical liaison or program leadership capacity.
• Excellent communication, influencing, and cross-functional collaboration skills.
• Ability to manage competing priorities across multiple programs and business units.
• Demonstrated ability to lead cross-functional technical programs and influence at senior levels.

Pay Range and Benefits

$227,300.00 - $340,900.00. The company also offers a competitive annual discretionary bonus program and opportunities for annual RSU grants.

EEO Statement

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.