Field Applications Engineer (FAE) Intern - Summer 2027

NXP Global Sales Introduction AI is rapidly moving beyond research labs and into the real world—powering advancements in vehicles, factories, hospitals, homes, and connected devices. NXP brings together secure edge intelligence, advanced semiconductor solutions, and deep system expertise to help customers build what’s next. Our Global Sales and Applications organization partners with customers to align technical solutions to application requirements, solve integration challenges, and accelerate design wins. We are seeking a technically curious engineering student to join our Field Applications team and help enable the integration of NXP semiconductor technologies into real customer systems. Program Overview The NXP Americas Global Sales & Applications Summer Internship is a 12 week, paid program for rising juniors, seniors, and graduate students who combine a strong technical foundation with the drive and curiosity to work directly with customers. Interns are embedded in the Field Application Engineering organization, paired with an experienced FAE mentor, and assigned meaningful technical work from day one. This internship is a primary pipeline into NXP’s Technical Sales & Applications Program (TSAP), our early-career pathway for full-time technical sales and applications roles. Strong performers may receive a return offer upon graduation. What You'll Do As a Field Applications Engineering Intern, you will work alongside experienced FAEs on customer-facing technical projects with real business impact. You will help translate application requirements into practical NXP-based solutions, support evaluations and proof-of-concepts, and develop hands‑on experience with embedded systems, lab validation, and design‑in activity. Sample responsibilities include: Work alongside FAEs to understand customer requirements and help select appropriate NXP MCUs, MPUs, connectivity, analog, power-management, and edge-processing solutions. Support technical customer meetings, design reviews, product evaluations, proof-of-concept activities, and NXP solution demonstrations. Help analyze customer issues, reproduce problems, document findings, and contribute to clear technical action plans and follow‑up. Embedded Development & System Integration Bring up evaluation boards and reference designs; configure SDKs and development environments; and integrate example software into application prototypes. Develop or modify firmware and application code in C, C++, Python, or similar languages under the guidance of experienced engineers. Support embedded software debugging and system integration across real-time control, sensor interfaces, connectivity, Linux, or RTOS-based applications. Lab Validation & Design Support Perform product evaluation, lab validation, and basic system-level troubleshooting using oscilloscopes, logic analyzers, multimeters, power supplies, current/voltage probes, power analyzers, and software debug or trace tools. Assist with schematic and PCB reviews, interface checks, power-up sequencing, signal observations, and hardware/software integration investigations. Create concise test plans, capture measurements, organize results, and communicate conclusions to technical and non-technical stakeholders. Technical Enablement & Communication Prepare customer‑ready technical presentations, demonstrations, quick‑start guides, application notes, and training material with guidance from senior engineers. Capture customer feedback and collaborate with sales, marketing, product management, product‑line, and engineering teams to improve tools, software, documentation, and support content. Present your summer project findings, technical approach, results, and recommendations to sales and applications leadership in a final intern capstone presentation. About You Minimum Qualifications Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, Mechatronics, or a related technical field. Rising junior, senior, or graduate student — expected graduation between December 2027 and June 2029. Cumulative GPA of 3.0/4.0 or higher. Authorization to work in the United States (no sponsorship available for intern roles). Availability for 12 weeks full-time during Summer 2027 (May–August). Preferred Qualifications Coursework or project experience in embedded systems, analog and digital circuits, computer architecture, microcontrollers/processors, wireless communications, power electronics, control systems, or semiconductor applications. Hands‑on experience with microcontrollers, MPUs, FPGAs, development boards, evaluation kits, or reference designs; familiarity with ARM‑based systems is a plus. Programming experience in C, C++, Python, or similar languages, with exposure to IDEs, SDKs, version control, RTOS basics, or embedded Linux. Familiarity with common embedded interfaces such as UART, SPI, I2C, CAN, USB, or Ethernet. Experience using or willingness to learn common lab equipment, schematic/PCB review, board bring‑up, firmware debugging, sensor integration, motor control, edge AI, or robotics applications. Who Thrives Here You are curious about how semiconductor products solve real‑world system problems and enjoy learning by building and testing. You approach debugging methodically: form a hypothesis, measure the system, isolate variables, and document the result. You communicate clearly with engineers, customers, sales teams, and non‑technical stakeholders. You are proactive, take ownership, collaborate well, and adapt to changing priorities in a customer‑focused environment. You are motivated to develop both technical expertise and business understanding while contributing to team results. What You'll Get Competitive paid hourly compensation. Dedicated FAE/TSE mentor and day‑to‑day manager support throughout the program. Hands‑on exposure to the semiconductor applications cycle — from requirements discovery and technical evaluation through proof‑of‑concept and design‑in support. Participation in intern cohort events, including professional development workshops, executive speaker sessions, and cross‑functional networking opportunities. Access to structured learning on NXP product portfolios, embedded systems, customer applications, and the semiconductor industry. Potential relocation support or housing stipend (location‑dependent). Consideration for a return full‑time offer into NXP’s TSAP program upon graduation. Locations Field Sales Offices across the United States — including but not limited to: Austin, TX | Detroit, MI | San Jose, CA Preferred location will be discussed during the interview process. Some local customer travel may be expected. NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #J-18808-Ljbffr