Manufacturing Engineer

Staff Manufacturing EngineerTE Connectivity, Sensors BU, is a world leader in the design and manufacture of Micro Electro-Mechanical Systems ("MEMS") that lie at the heart of the advanced sensing market, enabling devices in the medical, industrial, digital consumer, security, and automotive sectors. The company has established itself as a premier provider of MEMS-based pressure sensors for a range of markets, supplying advanced high and low-pressure sensor products that meet the stringent requirements for industry and consumer safety. TE Connectivity design, production and quality control processes have enabled it to develop both the smallest and smartest pressure sensors available today. TE offers a wide range of pressure sensors, including uncompensated sensors, temperature compensated and calibrated products as well as sensor systems consisting of an ASIC paired with a sensor die in a custom package.The Staff Process/Manufacturing Engineer is responsible for being the expert for all wafer processing and development used in the fabrication of MEMS devices. This role requires applying engineering principles in materials science, manufacturing engineering, mechanical engineering, and semiconductor processing to support yield improvement, equipment qualification, tooling development, and process control. The Engineer collaborates closely with Production, R&D, Quality, and global Engineering teams to evaluate process performance, implement statistical controls, and manage technical problem-solving across assigned product lines. This person will be a mentor for young engineers and work to share knowledge to help advance others.Essential FunctionsProcess Ownership & ImprovementProduct Line Engineering & Technical ExpertProduction Support & Problem ResolutionProcess Development & ValidationSafety & ComplianceEducation, Skills and Experience RequiredBS/MS in Mechanical, Electrical, Chemical, Manufacturing, or Materials Engineering (or closely related engineering field). Hands?on experience with semiconductor/MEMS wafer processing in a cleanroom environment. Demonstrated data driven decision making Proficiency with engineering tools such as metrology equipment, wafer probing systems, SPC/DOE software (Minitab/JMP). Experience with process control, formal process release, and engineering documentation (PFMEA, control plans, specifications). Strong analytical and statistical skills with demonstrated use of ANOVA, SPC, DOE, or advanced data analysis methods in production environment.Desired QualificationsExperience with MEMS fabrication (pressure sensors, accelerometers) or semiconductor wafer mapping formats (Klarf, XML). Six Sigma Black Belt Certification Experience with Pressure Sensor Characterization and application Knowledge of MES or SAP systems; ability to extract and analyze large datasets (SQL, Tableau). Experience with Python programming, and Labview desired Experience with safety programs, equipment qualification, and supplier technical management.Competencies Values: Integrity, Accountability, Inclusion, Innovation, TeamworkCOMPENSATION Competitive base salary commensurate with experience: $121,600 – $182,200 (subject to change dependent on physical location)