Manufacturing Operations Coordinator, Proc/Prod (Swing)

Job Description

Job Description

Manufacturing Operations Coordinator, Proc/Prod (Swing) 37370799

• Hourly pay: $28/hr
• Worksite: Leading electronic testing company (Santa Rosa, CA 95403 - Onsite)
• W2 Employment, Group Medical, Dental, Vision, Life, Retirement Savings Program, PSL
• 40 hours/week, 24 Month Assignment

A leading electronics testing company is seeking a Manufacturing Operations Coordinator, Proc/Prod (Swing) to support integrated circuit (IC) package testing operations within a semiconductor manufacturing environment. This role is responsible for performing production and prototype testing, operating semi-automated test equipment, verifying product quality, and preparing finished products for shipment while ensuring compliance with quality and customer requirements.

Manufacturing Operations Coordinator, Proc/Prod (Swing) Responsibilities:

• Perform IC package testing operations, including trim and form, seal integrity verification, leak testing, visual inspection, and DC/RF electrical testing using semi-automated test systems.
• Set up, operate, and monitor testing equipment to validate product performance, ensure quality standards are met, and support both production and prototype builds.
• Handle delicate IC packages and chips, prepare finished products for shipment, including tape-and-reel packaging, and maintain accurate production records.
• Collaborate with engineering, maintenance, and cross-functional teams to troubleshoot issues, support process improvements, and ensure efficient test operations.
• Maintain compliance with ESD, quality, and manufacturing procedures while managing multiple priorities in a fast-paced production environment.

Manufacturing Operations Coordinator, Proc/Prod (Swing) Qualifications:

• Experience in semiconductor manufacturing, electronics testing, production operations, or a related technical environment.
• Ability to work in an ESD-controlled environment and follow detailed manufacturing procedures.
• Experience handling small electronic components, IC packages, chips, or other delicate products.
• Familiarity with integrated circuit fabrication processes such as package testing, trim and form, leak testing, visual inspection, or related operations is preferred.
• Technical experience with electronics testing, troubleshooting, or test equipment operation is preferred.
• Proficiency with Microsoft Office applications, including Outlook, Excel, and Word.
• Strong attention to detail and commitment to maintaining high-quality standards.
• Excellent verbal and written communication skills with the ability to work effectively across departments.
• Ability to multitask, prioritize work, and adapt quickly in a dynamic manufacturing environment.
• Willingness to learn new skills, take on increasing responsibilities, and contribute to continuous improvement efforts.

Shift:

• Required flexibility for training on a day shift, then the candidate will transition to a Swing Shift.