Hybrid Silicon Photonics Tech Lead - 3D IC Packaging
TSMC - Taiwan Semiconductor Manufacturing Company Limited
A leading semiconductor manufacturing company is seeking a Technical Lead/Manager for Silicon Photonics. In this hybrid role located in San Jose, you'll work closely with industry partners to develop and implement innovative silicon photonics solutions. The ideal candidate should have a Master's or PhD, along with over 10 years of experience in silicon photonics design and characterization. Strong skills in project management, optical packaging, and simulation tools are essential. Competitive salary offered, reflecting qualifications and experience. #J-18808-Ljbffr TSMC - Taiwan Semiconductor Manufacturing Company Limited
$149k - $263k
...Silicon Photonics - Technical Lead As a Technical Lead/Manager – Silicon Photonics... ...operating in a hybrid work schedule with 4 days... ...multi-die silicon photonics packaging solutions with 3D integration. Minimum... ...customer innovation with 3D IC technologies and optimal...3DWork at office$150k - $250k
...seeking a highly motivated Photonics IC Technical Lead to join our team. In this role... ...design and development of silicon photonics devices, sub-... ...tapeout, electromagnetics, packaging, and semiconductor physics.... ...simulation toolslikeLumerical, Tidy3d, COMSOL Portfolio of...3DFlexible hours$211k - $356k
...who has repeatedly translated silicon photonics innovation into high-volume commercial... ...across design, process, packaging, test, and operations. This leader... ...and business strategy. Lead end‑to‑end development of silicon photonics ICs from requirements, architecture...SuggestedTemporary work$211k - $356k
MediaTek in San Jose, California is looking for a leader in silicon photonics design to drive the development of next-generation photonic integrated circuits. The role requires over 15 years of experience, a PhD or MS degree in related fields, and proven leadership in commercial...Suggested$150k - $250k
A cutting-edge technology company in Sunnyvale, California, is looking for a Photonics IC Technical Lead. In this role, you will lead the design and development of silicon photonics devices, collaborating with a multidisciplinary engineering team. The ideal candidate will...SuggestedFlexible hours- ...building the critical photonics infrastructure... ...optical layer from the silicon up. You’ll work... ...an experienced IC Package Mechanical FEA Engineer... ...such as 3DIC, hybrid copper bonding, and... ...chip, FOWLP, 2.5D/3D integration,... ...reliability perspective. Lead DOE studies and...3DLocal area
- ...building the critical photonics infrastructure... ...layer from the silicon up. You’ll work... ...—leveraging co-packaged optics (CPO),... ...the world's leading AI providers.... ...across complex 2.5D/3D packages. These... ...electrical ICs, photonic ICs,... ...die links, and hybrid electrical-optical...3D
$190.61k - $269.1k
## Senior Photonics Design Engineer, Actives... ...forefront of silicon photonics... ...world's first hybrid silicon laser nearly... ...team continues to lead the industry... ...form factors, co-packaging solutions, and... ..., RSoft, Tidy3D, Harold-Photon... ...speed electronic ICs including modulator...3DLocal areaShift work- Siemens AG is looking for a Marketing Programs Manager focused on 3D IC Design & Advanced Packaging Solutions. The role involves developing marketing strategies, managing campaigns, and collaborating with teams to enhance market visibility. Candidates should have a Bachelor...3D
$211k - $356k
...advanced optical packaging architectures for... ...optical engines, silicon photonics products, and co-packaged... ...substrate design, hybrid bonding... ...effectively across PIC, IC, systems, reliability... ...platforms. Lead design and optimization... ...with 2.5D/3D integration, flip‑...3DTemporary work$195k - $235k
...looking for a highly experienced Photonics Chip Lead to take ownership of the... ...technical expertise in Silicon Photonics systems, block and... ...as well as proficiency with IC design tools and PIC/ASIC co... ...with analog, digital, and packaging teams to ensure all product...- ...AI infrastructure company in San Jose is seeking a Senior / Principal Power Integrity Engineer to lead power delivery strategies for complex 2.5D and 3D integrated packages. This role involves designing robust power delivery networks (PDNs) for high-performance...3D
- ...building the critical photonics infrastructure... ...layer from the silicon up. You’ll work... ...through co‑packaged optics (CPO),... ...across complex 2.5D/3D packages that... ...electrical ICs, photonic ICs,... ...using industry‑leading tools (e.g., Ansys... ...FOWLP, CoWoS, hybrid bonding, or similar...3D
$211k - $356k
...Quality & Reliability to lead quality and reliability... ...optical engines, co-packaged optics (CPO), and AI networking... ...with teams across PIC, IC, assembly, packaging,... ...or failure analysis in photonics, semiconductors,... ...optical engines or modules, silicon photonics, or related...Temporary work- ...building the critical photonics infrastructure that powers... ...optical layer from the silicon up. You’ll work... ...silicon tapeouts, advanced packaging, bring-up, validation,... ...Partner with engineering leads and cross-functional teams... ...technologies (2.5D/3D integration, chiplets,...3D
- ...US based deep‑tech company developing... ...advanced photonic technologies that... ...: Principal Packaging Engineer Department... ...: Packaging / IC Design Location: US (Hybrid / Onsite)... ...leverages silicon photonics to unlock... ...edge 2.5D and 3D packaging... ...Photonic Packaging Lead the...3DPermanent employmentFull time
$141k - $195.88k
...cutting‑edge physical layer ICs that power high‑speed... ...& Responsibilities Lead the development of best... ...evaluation of prototype silicon in close collaboration... ...modulators, EMLs, silicon photonics) is desirable.... ...Conditions 40‑hour work week, hybrid work, (min 3 days on‑...Full timeWork at office- ...Company: Siemens EDA Job Title: Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions Job Reference #: 506118 Job Location:... ...platforms, industry trends (e.g., chiplets, wafer‑on‑wafer, hybrid bonding), and innovative approaches to maximize Siemens EDA...3DFull timeWork at officeWork from home
- A tech startup in San Jose is seeking an experienced IC Package Mechanical FEA Engineer to drive high-performance packaging solutions for advanced ASICs. The role involves FEA simulations to evaluate stress and reliability, requiring deep expertise in packaging technologies...3D
- ...Advanced Packaging Technical Leader Cisco is seeking a seasoned Advanced Packaging Technical... ...manufacturers and other key suppliers leading technical discussions and problem-... ...packaging technology (flip-chip, fanout, 2.5D/3D, hybrid integration). Oversee various aspects...3DContract work
$192k - $278k
...assembly). Experience in 3D Integrated Circuit (3D IC) design (e.g., multi-die partitioning... ..., advanced chiplet and packaging technologies, optimizing... ...DRC/LVS/EMIR issues for leading edge nodes. Experience... ...boundaries, developing custom silicon solutions that power the...3DFull timeWorldwide- A leading semiconductor foundry is seeking an experienced professional in advanced packaging technology to join their Field Technical Solutions team... ...in cutting-edge 2.5D/3D packaging. Ideal candidates... ...competitive salary and is part of a hybrid work model. #J-18808-Ljbffr...3D
- ...delivered more than one billion ICs over the past 25 years solving... ...for an enthusiastic, self-driven Lead IC Applications Engineer to... ...evaluate leading-edge RF/mmwave silicon and provide technical support to... ...Experience with SI/PI and 2.5D/3D EM board simulation tools is highly...3D
- ...Space in the heart of Silicon Valley in Santa... ...opportunity to work in a hybrid onsite role, collaborating with a leading Semiconductor... ...Clara offers a vibrant tech community and a... ...with the creation of IC product collateral... ...modulators, EMLs, silicon photonics) is desirable....Work at office
$181.1k - $318.4k
Apple Inc. is seeking an experienced IC Packaging Engineer in Santa Clara, California. This role involves driving packaging development and leading cross-functional teams in advanced semiconductor packaging solutions. Candidates must have a passion for innovation and at...3D$168.8k - $241.2k
...Cisco is seeking a seasoned Advanced Packaging Technical Leader to join the Packaging Technology... ...manufacturers and other key suppliers leading technical discussions and problem-... ...packaging technology (flip-chip, fanout, 2.5D/3D, hybrid integration). Oversee various aspects...3DFull timeContract workTemporary workLocal areaFlexible hours- ...(ATE) to the semiconductor industry. We lead the way in developing new and innovative... ...Japan and its US subsidiary based in the Silicon Valley, AAI possesses a cross-cultural blend... ...is in our rapidly growing Silicon Photonics team. The ideal candidate has knowledge on...
- ...looking for a Senior Application Engineer with a strong background in optical engineering and hands-on experience in testing silicon photonics devices. The ideal candidate will have extensive experience with using optical and electrical test equipment (e.g., OSA, power...
- ...self-driving cars to learning machines. We lead in chip design, verification, and IP... ...empowering the creation of high-performance silicon chips and software content. Join us to... ...7nm/5nm/3nm), mixed-signal IP, and 2.5D/3D IC packaging is highly desirable. ~ Deep knowledge...3D
$160k - $200k
High-Speed Photonic Integrated Circuit (PIC) Researcher Location: Santa Clara, California •... ...simulations, and PIC layout with an eye for packaging and commercialization. A deep... ...design, and layout (e.g., Lumerical, Tidy3D, IPKISS, KLayout, Cadence) Experience in...3DRelocation package
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