Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions - Siemens EDA
Siemens AG
Job Family: Software Req ID: 506118 Company: Siemens EDA Job Title: Marketing Programs Manager – 3D IC Design & Advanced Packaging Solutions Job Reference #: 506118 Job Location: Wilsonville, OR, Santa Clara, CA or Boulder, CO Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost‑effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design. We are seeking a visionary and results‑oriented Marketing Leader to spearhead high‑impact, cross‑portfolio marketing programs specifically focused on our 3D IC Design and Advanced Packaging Solutions. This pivotal role will advance Siemens EDA’s strategic market position in this rapidly evolving and critical domain. Reporting to the Director of Marketing Programs and Communications, you will architect and execute innovative marketing campaigns that amplify Siemens EDA's visibility, thought leadership, and market share in the 3D IC and advanced packaging segments. As a key member of our newly formed strategic marketing organization, you will have high visibility and the opportunity to shape our go‑to‑market approach across the Siemens EDA portfolio, specifically targeting the unique challenges and opportunities presented by heterogeneous integration and 3D IC architectures. Key Responsibilities Strategic Planning & Leadership for 3D IC/Advanced Packaging Architect comprehensive, data‑driven marketing strategies tailored to Siemens EDA's 3D IC design, multi‑die integration, and advanced packaging solutions, aligning with growth initiatives and market positioning. Identify emerging platforms, industry trends (e.g., chiplets, wafer‑on‑wafer, hybrid bonding), and innovative approaches to maximize Siemens EDA's market visibility and competitive differentiation in this specialized area. Articulate the value proposition of Siemens EDA's solutions for addressing critical 3D IC challenges such as thermal management, power delivery, signal integrity, co‑design, and verification. Campaign Management & Execution Orchestrate integrated, multi‑channel marketing campaigns that deliver measurable business outcomes for our 3D IC and advanced packaging offerings. Ensure consistent brand messaging and visual identity across all marketing assets and touchpoints, highlighting Siemens EDA's expertise in heterogeneous integration. Direct external agencies and vendors to deliver high‑quality, on‑brand campaign elements, potentially including technical white papers, application notes, and webinars focused on 3D IC methodologies. Cross‑functional Collaboration Partner closely with product management, R&D, sales, and executive leadership to align marketing initiatives with business objectives for our 3D IC and advanced packaging portfolio. Build strong stakeholder relationships across the organization to drive marketing integration and effectiveness, particularly with teams focused on physical verification, design for test (DFT), and system‑level analysis for 3D ICs. Performance Measurement & Optimization Establish key performance indicators (KPIs) to measure campaign effectiveness and return on investment for 3D IC‑focused marketing initiatives. Continuously refine marketing approaches based on performance data and market feedback, adapting to the rapid evolution of 3D IC and advanced packaging technologies. Monitor competitor activities and market trends in the 3D IC and advanced packaging space to inform strategic marketing decisions. Required Qualifications Bachelor’s degree in Marketing, Business Administration, Electrical Engineering, Computer Engineering, or a related technical field. Deep understanding and passion for 3D IC design, heterogeneous integration, advanced packaging technologies (e.g., 2.5D, chiplets, fan‑out), and the associated EDA challenges (e.g., thermal, power, reliability, co‑design). Outstanding communication and presentation skills with the ability to influence at all organizational levels, including technical experts and executive leadership. Strong analytical skills with experience in marketing metrics analysis and performance optimization. Willingness to travel domestically and internationally (approximately 20%). Why us? Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software. A collection of over 377,000 minds building the future one day at a time in over 200 countries. We’re dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow! Siemens Software. Transform the Everyday with Us
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102,500 184,500 5-8 Organization: Digital Industries Job Type: Full‑time Category: Marketing #J-18808-Ljbffr Siemens AG- Overview Job Title: Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions Job Reference #: 506118 Job Location: Wilsonville, OR; Santa Clara, CA; or Boulder, CO Siemens EDA is a global technology leader in Electronic Design Automation software. Our...3D
- Siemens AG is looking for a Marketing Programs Manager focused on 3D IC Design & Advanced Packaging Solutions. The role involves developing marketing strategies, managing campaigns, and collaborating with teams to enhance market visibility. Candidates should have a Bachelor...3D
$133.5k - $183.5k
: Program Manager - Advanced Packaging (E4)Skip to main contentThis site uses cookies to... ...in materials engineering solutions used to produce virtually... ...display in the world. We design, build and service cutting... ...including: - Logic (2.5D/3D integration, chiplets, hybrid...3DFull timeRelocation$133.5k - $183.5k
...Lead end-to-end customer programs, including technical... ...Execution & Delivery Manage complex, multi-disciplinary... ...in-depth knowledge of advanced packaging inflections including: Logic (2.5D/3D integration, chiplets,... ...customer needs into IMS solution strategies Value...3DFull timeRelocation$174k - $239.5k
...materials engineering solutions used to... ...new chip and advanced display in the world. We design, build and service... ...to providing programs and support... ...seasoned **Product Marketing Manager** recognized... ...in **Advanced Packaging**. This role... ...(e.g., 2.5D/3D-IC, FOWLP, fan-out...3DFull timeRelocation$174k - $239.5k
...materials engineering solutions used to produce... ...new chip and advanced display in the world. We design, build and service... ...committed to providing programs and support that... ...seasoned Technical Marketing Manager recognized as a... ...in Advanced Packaging . This role is responsible...Full timeRelocation- ...Senior Technical Program Manager SAN JOSE, CA / Onsite... ...line of code, every design decision, every breakthrough... ...silicon tapeouts, advanced packaging, bring-up, validation... ...silicon, packaged solutions, and validated... ...packaging technologies (2.5D/3D integration, chiplets...3D
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...Apple Inc. is seeking an experienced IC Packaging Engineer in Santa Clara, California. This role involves driving packaging... ...development and leading cross-functional teams in advanced semiconductor packaging solutions. Candidates must have a passion for innovation and at...3D$138k - $190k
Advanced Packaging Integration Engineer page is loaded##... ...engineering solutions used to produce virtually... ...in the world. We design, build and... ...committed to providing programs and support that... ...packaging and 3D integration... ...reliability.* Lead and manage complex technical...3DFull timeWork at officeRelocation$272k - $431.25k
...generation AI and graphics memory solutions! This role sits at the intersection of I/O design, advanced packaging, and process technology, with... ...TSV stacking and refresh management to advanced reliability and... ...memory packaging and 3D integration. Familiarity with...3DFull time$163k - $237k
Senior Physical Design Flow and... ...Experience with EDA tools for... ..., Synopsys, Siemens). Experience... ...(Caliber/IC Validator),... ...Familiarity with 2.5D/3D IC packaging and proficiency with advanced parasitic... ...silicon solutions that power the... ..., and data management systems for...3DWorldwide$181.1k - $318.4k
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...engineering solutions from silicon... ...leading silicon design, IP,... ...and product managers. At Synopsys... ...whether advanced designs close... ...CPU designs, 3D IC systems, and advanced packaging structures... ...of relevant EDA or CAD software... ...Proficiency in C++ programming, algorithm...3DRemote workDay shift$180k - $240k
...California, is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-... ...involves collaborating with IC design teams and managing vendor relationships to ensure cutting-edge packaging solutions. The ideal candidate will have...3D- Applied Materials is looking for a Technical Marketing Manager in Santa Clara, CA. This key position involves developing advanced packaging solutions, market analysis, and cross-functional collaboration. The ideal candidate holds an MS or PhD and has over 10 years of experience...
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Google is seeking an Advanced Packaging Technologist in Sunnyvale, California. You will work on IP-driven TPU (Tensor Processing Unit) technology... ...The role includes responsibilities for developing packaging solutions for advanced technology, collaborating across teams, and...3DFull time$268k - $402k
...leader in engineering solutions from silicon to... ...-leading silicon design, IP, simulation and... ...like. You do not manage by deck, you manage... ...to translate a market shift into a three... ...DIC silicon IP and advanced packaging design, covering layout... ...with EDA tool development teams...Remote workShift work$210k - $260k
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...our tight‑knit physical design team, you will be... ...design and analysis of 3D integrated products. This... ...design skills, packaging, power, clock and cooling... ...2.5D or 3D packaging solutions. Must have experience... ...forefront of groundbreaking advancements in AI! Cerebras...3D$167k - $250k
...world’s first 3D-stacked photonics... ...for the most advanced AI and HPC... ...Senior Technical Program Manager to help... ...engineering team from design through... ...development, packaging, assembly, and... ...communication, and laser solutions Experience... ..., and market data. Salary Range...3DFull timeTemporary workFlexible hours- ...for hardware design. Our product helps... ..., time to market and reliability... ...cooling, thermal management, and product... ...Ansys ICEPAK, Siemens FLOTHERM,... ...semiconductor electronics packaging and advanced cooling (cold... ..., 2.5D/3D IC, etc.) Experience... ...—ideally EDA or simulation...3DWork at office3 days per week
$199.3k - $348.8k
...systems and solutions for the... ...circuits, packaging, printed circuit... ...that are advancing humanity... ...chip design, KLA's Global... ...semiconductor IC... ...Product Marketing Director... ...Foundry, DRAM, 3D NAND, and... ...Lifecycle Management (PLC)... ...including beta programs and customer...3DMinimum wageWorldwideFlexible hours$216k - $345k
## Principal Solutions Architect - Semiconductor TestApplylocations... .... This covers wafer and package test operations from... ...guidelines for the test program, Test Methods/Class structure... ...or custom).* Exposure to advanced packaging test challenges (2.5D/3D, chiplets, KGD).* Prior...3D$150k - $250k
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...materials engineering solutions used to produce... ...new chip and advanced display in the world. We design, build and... ...committed to providing programs and support... .../Project Manager is responsible... ...structure readiness Packaging and logistics... ...analytics, advertising, or marketing purposes.Full timeRelocation$125k - $200k
...world’s most advanced... ...are still designed using workflows... ...across thermal, packaging, and system... ...real design programs—particularly... ...understood by the market. The buyer... ...technical IC domain... ...Lifecycle Management: Lead the end... ...including EDA tools,... ...packaging (2.5D/3D IC)....3DContract workWork at office3 days per week$100k - $136.5k
...engineering solutions used to produce... ...chip and advanced display in the... ...world. We design, build and service... ...providing programs and support... ...advanced packaging. This role involves... ...‑chip, and 3D integration.... ...them in the market. Leadership... ...with manageable risks and resource...3DFull timeWork at officeWork from homeRelocation$230k - $280k
...seeking a skilled engineer to join our physical design team in Sunnyvale, California. You will focus on the design and analysis of 3D integrated products and collaborate with architecture and RTL teams on innovative solutions. The ideal candidate will have over 10 years...3D$133.5k - $183.5k
Applied Materials, Inc. is seeking a Program Manager in Santa Clara, CA, to lead customer programs and manage complex technical... ...-facing program management. Strong understanding of advanced semiconductor packaging technologies is essential. The position offers a competitive...- ...in electronic design, simulation, prototyping... ...world-class solutions in... ...semiconductor markets for customers in... ...upgrades using Siemens NX 3D CAD simulation program or modeling. Transfer... ..., assembly and packaging. Support, implement... ...Engineer III / Advanced Level...3DFlexible hours
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