Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions - Siemens EDA
Siemens AG
Job Family: Software Req ID: 506118 Company: Siemens EDA Job Title: Marketing Programs Manager – 3D IC Design & Advanced Packaging Solutions Job Reference #: 506118 Job Location: Wilsonville, OR, Santa Clara, CA or Boulder, CO Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost‑effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design. We are seeking a visionary and results‑oriented Marketing Leader to spearhead high‑impact, cross‑portfolio marketing programs specifically focused on our 3D IC Design and Advanced Packaging Solutions. This pivotal role will advance Siemens EDA’s strategic market position in this rapidly evolving and critical domain. Reporting to the Director of Marketing Programs and Communications, you will architect and execute innovative marketing campaigns that amplify Siemens EDA's visibility, thought leadership, and market share in the 3D IC and advanced packaging segments. As a key member of our newly formed strategic marketing organization, you will have high visibility and the opportunity to shape our go‑to‑market approach across the Siemens EDA portfolio, specifically targeting the unique challenges and opportunities presented by heterogeneous integration and 3D IC architectures. Key Responsibilities Strategic Planning & Leadership for 3D IC/Advanced Packaging Architect comprehensive, data‑driven marketing strategies tailored to Siemens EDA's 3D IC design, multi‑die integration, and advanced packaging solutions, aligning with growth initiatives and market positioning. Identify emerging platforms, industry trends (e.g., chiplets, wafer‑on‑wafer, hybrid bonding), and innovative approaches to maximize Siemens EDA's market visibility and competitive differentiation in this specialized area. Articulate the value proposition of Siemens EDA's solutions for addressing critical 3D IC challenges such as thermal management, power delivery, signal integrity, co‑design, and verification. Campaign Management & Execution Orchestrate integrated, multi‑channel marketing campaigns that deliver measurable business outcomes for our 3D IC and advanced packaging offerings. Ensure consistent brand messaging and visual identity across all marketing assets and touchpoints, highlighting Siemens EDA's expertise in heterogeneous integration. Direct external agencies and vendors to deliver high‑quality, on‑brand campaign elements, potentially including technical white papers, application notes, and webinars focused on 3D IC methodologies. Cross‑functional Collaboration Partner closely with product management, R&D, sales, and executive leadership to align marketing initiatives with business objectives for our 3D IC and advanced packaging portfolio. Build strong stakeholder relationships across the organization to drive marketing integration and effectiveness, particularly with teams focused on physical verification, design for test (DFT), and system‑level analysis for 3D ICs. Performance Measurement & Optimization Establish key performance indicators (KPIs) to measure campaign effectiveness and return on investment for 3D IC‑focused marketing initiatives. Continuously refine marketing approaches based on performance data and market feedback, adapting to the rapid evolution of 3D IC and advanced packaging technologies. Monitor competitor activities and market trends in the 3D IC and advanced packaging space to inform strategic marketing decisions. Required Qualifications Bachelor’s degree in Marketing, Business Administration, Electrical Engineering, Computer Engineering, or a related technical field. Deep understanding and passion for 3D IC design, heterogeneous integration, advanced packaging technologies (e.g., 2.5D, chiplets, fan‑out), and the associated EDA challenges (e.g., thermal, power, reliability, co‑design). Outstanding communication and presentation skills with the ability to influence at all organizational levels, including technical experts and executive leadership. Strong analytical skills with experience in marketing metrics analysis and performance optimization. Willingness to travel domestically and internationally (approximately 20%). Why us? Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software. A collection of over 377,000 minds building the future one day at a time in over 200 countries. We’re dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow! Siemens Software. Transform the Everyday with Us
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102,500 184,500 5-8 Organization: Digital Industries Job Type: Full‑time Category: Marketing #J-18808-Ljbffr Siemens AG- Siemens AG is looking for a Marketing Programs Manager focused on 3D IC Design & Advanced Packaging Solutions. The role involves developing marketing strategies, managing campaigns, and collaborating with teams to enhance market visibility. Candidates should have a Bachelor...3D
- ...Req ID: 503814 Siemens EDA is a global technology... ...in Electronic Design Automation (EDA) software... ...workflow solutions for advanced 2.5D and 3D System-in-Package (SIP) designs. Your... ...physical design and 3D-IC planning tools for... ...lifecycle/data management (PLM/IPLM) systems...3D
- ...for a Technical Program Manager (ASIC/SoC Design) located in San... ...bottlenecks in advanced nodes (2nm/4nm)... ..., and advanced packaging requirements (2.5D/3D, HBM, Chiplets)... ...with EDA tool capabilities... ...major DSP (Design Solution Partner) ecosystem. • Market Insight: Knowledge...3DFull time
- ...seeking experienced engineers to design advanced 2.5D and 3D interposer solutions. The ideal candidate will work on... ...designs, and ensure adherence to packaging and signal integrity requirements.... ...skills, and experience with relevant EDA tools are essential. This role offers...3D
$174k - $239.5k
...materials engineering solutions used to... ...new chip and advanced display in the world. We design, build and service... ...to providing programs and support... ...seasoned **Product Marketing Manager** recognized... ...in **Advanced Packaging**. This role... ...(e.g., 2.5D/3D-IC, FOWLP, fan-out...3DFull timeRelocation$174k - $239.5k
...materials engineering solutions used to produce... ...new chip and advanced display in the world. We design, build and service... ...committed to providing programs and support that... ...seasoned **Technical****Marketing Manager** recognized as a... ...in **Advanced Packaging**. This role is responsible...Full timeRelocation- Senior Technical Program Manager SAN JOSE, CA / Onsite About... ...line of code, every design decision, every... ...complex silicon tapeouts, advanced packaging, bring-up, validation... ...quality silicon, packaged solutions, and validated... ...packaging technologies (2.5D/3D integration, chiplets...3D
- ...We lead in chip design, verification,... ...mentorship and advanced technical collateral... ...products to market with confidence... ...and innovative solutions to our most... ...signal IP, and 2.5D/3D IC packaging is highly... ...Deep knowledge of EDA tools, especially... ..., and able to manage multiple...3D
- ...line of code, every design decision, every breakthrough... ...an experienced IC Package Mechanical FEA Engineer... ...packaging solutions for advanced ASICs. In this role,... ...flip‑chip, FOWLP, 2.5D/3D integration, chiplet... ...needs. Excellent self‑management, organizational discipline...3DLocal area
$146.7k - $293.4k
...Siemens EDA is a global technology leader in Electronic Design Automation software. Our software... ...Technology Manager (ATM) develops and... ...teams designing advanced IC packages and heterogeneous... ...plans and sales/marketing campaigns to secure... ...the Innovator3D IC and Calibre3D...3DTemporary workWork at officeLocal areaWork from homeFlexible hours$138k - $190k
Advanced Packaging Integration Engineer page is loaded##... ...engineering solutions used to produce virtually... ...in the world. We design, build and... ...committed to providing programs and support that... ...packaging and 3D integration... ...reliability.* Lead and manage complex technical...3DFull timeWork at officeRelocation- Siemens AG is looking for a Software Engineer in Santa Clara, California. This role involves developing innovative EDA software products for advanced packaging designs, integrating industry-leading tools, and providing technical guidance. The ideal candidate should possess...3D
$181.1k - $318.4k
Apple Inc. is seeking an experienced IC Packaging Engineer in Santa Clara, California. This role involves driving packaging... ...development and leading cross-functional teams in advanced semiconductor packaging solutions. Candidates must have a passion for innovation and at...3D$210k - $300k
...Companies is seeking a Principal Advanced IC Packaging Engineer who will develop... .... Collaborate with design, test, and manufacturing teams... ...EMIB, InFO, and advanced 2.5D/3D integration technologies is... ...Strong knowledge of thermal management, reliability testing, and signal...3D$160.98k - $311.04k
...process and packaging technologies... ...world-class design ecosystem, and... ...to advance technologies... ...Senior Technical Solutions Engineer - Advanced... ...management to drive adoption... ...feedback and market insights Coordinate... ...success Program Management &... ...2.5D/3D, Chiplets, HBM...3DFull timeInternshipLocal areaImmediate startShift work$152.5k - $244k
Advanced Defect Modeling and... ...Technical Manager) (7101) Job... ...processes and 3D packaging... ...collaborate across design, process,... .... Use EDA ATPG tools... ...flexibility to push solutions forward... ...nodes. Programming or... ...innovation with 3D IC... ...consists of market competitive...3DVisa sponsorship$153.5k - $250k
Substrate / Advanced Package Engineer (71... ...chip-level design into package... ...delivery, thermal management, and... ...Optimization program. The position... ...principles, and EDA tools, with... ...to drive solutions in ambiguous... ...innovation with 3D IC technologies... ...consists of market competitive...3DLocal area$181.1k - $318.4k
...versatile and passionate IC Packaging Engineer to join our... ...the industry with advanced package solutions, new material developments... ...(FOWLP, 2.5D, 3D, coreless MCM). Well... ...package/PCB layout and designs in Allegro. Compensation... ...employee stock programs. Apple employees are...3DRelocationOverseas$190.61k - $269.1k
...Photonics Design Engineer, Actives... ...Photonics Solutions (IPS) is at... ...to advanced development... ...factors, co-packaging solutions,... ...development programs## **Qualifications... ...RSoft, Tidy3D, Harold-... ...electronic ICs including modulator... ...both broad-market Xeon-based... ..., product management, developing...3DLocal areaShift work- ...engineering solutions from silicon... ...leading silicon design, IP,... ...While most marketers focus on a single... ...workflow spanning EDA tools,... ...across Product Management, Sales,... ...and advocacy programs that demonstrate... ...; MBA or advanced degree preferred... ...rewards package. The actual...Immediate start
- A tech startup in San Jose is seeking an experienced IC Package Mechanical FEA Engineer to drive high-performance packaging solutions for advanced ASICs. The role involves FEA simulations to evaluate stress and reliability, requiring deep expertise in packaging technologies...3D
- ...IP Alliance Manager you will... ...including the most advanced processes... ...of EDA flows and tech... ...development Program management... ...Platform) marketing. Shuttle team... ...IP design experience... ...enablement solutions to unleash... ...innovation with 3D IC technologies... ...compensation package. At the time...3DWork at office
$120k - $192k
...experienced engineers to design cutting edge CoWoS 2.5D, 3D interposer... ...with packaging, signal integrity... ...interposer and advanced packaging design... ...Proficiency with EDA tools such as Cadence... ...teams including IC design engineers... ...Stock Purchase Program (ESPP), Employee...3D$174k - $239.5k
Applied Materials, Inc. is seeking a Technical Marketing Manager in Santa Clara, CA. This role focuses on advanced semiconductor packaging solutions, requiring expertise in product marketing, competitive analysis, and technical asset creation. The ideal candidate will possess...$150k - $250k
...highly motivated Photonics IC Technical Lead to join... ...role, you will lead the design and development of... ...tapeout, electromagnetics, packaging, and semiconductor physics... ...extensive experience using EDA tools and conducting... ...toolslikeLumerical, Tidy3d, COMSOL Portfolio of designedanddemonstratedphotonic...3DFlexible hours- ...AI for hardware design. Our product... ...performance, time to market and reliability... ...in electronics packages, chips, and... ...accurate modeling of advanced semiconductor... ..., managing booth activities... ...warpage, 2.5D/3D IC, etc.) Experience... ...software—ideally EDA or simulation tools...3DWork at office3 days per week
$210k - $260k
...infrastructure solutions that... ...across silicon, packaging, software,... ...Advanced Package Engineer... ...Flip Chip IC integration... ...packaging design, mechanical... ...interposers 3D packaging and... ...assembly, yield management, and rework... ...programs. Demonstrated... ...location, market trends, and...3DContract work$125k - $200k
...world’s most advanced... ...are still designed using workflows... ...across thermal, packaging, and system... ...real design programs—particularly... ...understood by the market. The buyer... ...technical IC domain... ...Lifecycle Management: Lead the end... ...including EDA tools,... ...packaging (2.5D/3D IC)....3DContract workWork at office3 days per week$211k - $356k
...and delivering advanced optical packaging architectures... ...architecture, substrate design, hybrid... ...warpage risk management, signal... ...effectively across PIC, IC, systems,... ...manufacturable product solutions.... ...Experience with 2.5D/3D integration,... ...term incentive programs. Actual total...3DTemporary work$167k - $250k
...world’s first 3D-stacked photonics... ...for the most advanced AI and HPC... ...Senior Technical Program Manager to help... ...engineering team from design through... ...development, packaging, assembly, and... ...communication, and laser solutions Experience... ..., and market data. Salary...3DFull timeTemporary workFlexible hours
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