Senior IC Packaging & Integration Engineer (2.5D/3D)
$181.1k - $318.4kApple Oakbrook
Apple Inc. is seeking an experienced IC Packaging Engineer in Santa Clara, California. This role involves driving packaging development and leading cross-functional teams in advanced semiconductor packaging solutions. Candidates must have a passion for innovation and at least 10 years of relevant experience. The position offers a competitive salary ranging from $181,100 to $318,400, along with comprehensive benefits including medical coverage, stock options, and educational reimbursements. Apple prides itself on diversity and inclusion, welcoming applicants from all backgrounds. #J-18808-Ljbffr
Vacancy posted 8 hours ago
Similar jobs that could be interesting for youBased on the Senior IC Packaging & Integration Engineer (2.5D/3D) in Santa Clara, CA vacancy
- ...Position Overview We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies. This role serves...Senior3DFull time
Rapidus Corporation US
Santa Clara, CA2 days ago $181.1k - $318.4k
...looking for versatile and passionate IC Packaging Engineer to join our team! Description You will... ...teams and lead SoC Package integration and architecture efforts Drive the industry... ...advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM). Well versed with DOE...3DRelocationOverseas- NVIDIA Gruppe is seeking an experienced professional to lead package-level reliability for semiconductor products in Santa Clara, California... ...a related field, along with 8+ years of hands-on experience in IC packaging and board level reliability, including familiarity...Senior3D
- Siemens AG is looking for a Software Engineer in Santa Clara, California. This role involves developing innovative EDA software products for advanced packaging designs, integrating industry-leading tools, and providing technical guidance. The ideal candidate should possess...Senior3D
- ...Overview We are seeking a highly motivated Chiplet Package Design Engineer to drive the development of advanced packaging... ...generation semiconductor products. This role focuses on 2.5D and 3D heterogeneous integration , enabling high-performance computing, AI, networking...Senior3DFull time
Rapidus Corporation US
Santa Clara, CA2 days ago $124k - $195.5k
Join us in an outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) at NVIDIA. Using our history of... ...packaging architecture and materials (flip‑chip, 2.5D/3D IC, CoWoS‑R, CoWoS‑L, advanced substrates). Excellent problem...Senior3D$138k - $190k
...Advanced Packaging Integration Engineer page is loaded## Advanced Packaging Integration Engineerlocations: Santa... ...innovative advanced packaging and 3D integration solutions.As an **Advanced... ...hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill...3DFull timeWork at officeRelocationApplied Materials
Santa Clara, CA8 hours ago$210k - $300k
...Companies is seeking a Principal Advanced IC Packaging Engineer who will develop and refine Chip-on-... ...teams to ensure flawless chip-package integration. Lead failure analysis and drive yield... ...with EMIB, InFO, and advanced 2.5D/3D integration technologies is a plus. Strong...3DPiper Companies
San Jose, CA9 hours ago- ...interconnects to scalable photonic engines, Lumilens is unlocking a new... ...are seeking an experienced IC Package Mechanical FEA Engineer to... ...packaging and photonic‑integration technologies, including co‑packaged... ...including flip‑chip, FOWLP, 2.5D/3D integration, chiplet...3DLocal area
Lumilens
San Jose, CA9 hours ago - ...technology takes more than great engineering—it takes a team of... ...Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical... ...spanning 2D and RDL based fan-out (2.5D), chiplet-based designs, and heterogeneous integration, leading efforts from early...Senior
Axiado
San Jose, CA22 days ago $160k - $210k
...candidate will design and implement packaging solutions for micro-optic... ...have M.S. in Electrical Engineering, Applied Physics or related field... ...assembly processes such as 3D and 2.5D assemblies Excellent... ...presentations), can work with senior external partners with ease....Senior3DFull time- ...NVIDIA Gruppe is looking for a skilled PCB Layout Engineer to engage in the design and development of advanced IC substrates. The ideal candidate will have 5+ years of relevant experience and a strong background in high-speed design using Cadence APD tools. This position...Senior
NVIDIA Gruppe
Santa Clara, CA9 hours ago - ...We are seeking a highly skilled ADK (Assembly Design Kit) Development Engineer to lead the creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging , including chiplet-based architectures, silicon interposers, and heterogeneous...Senior3DFull time
Rapidus Corporation US
Santa Clara, CA2 days ago $156k - $229k
...Mechanical, Material, Electrical Engineering, Technology, Science, a... ...years of experience in chip package substrate design using Cadence... ...(PoP), InFO, RDL, IPD, 2.5D/3D, Chiplet. Preferred qualifications... ..., efficiency, and integration. Google’s mission is to organize...Senior3DFull timeWorldwide$138k - $190k
...A leading technology company in Santa Clara is looking for an Advanced Packaging Integration Engineer to develop high-performance optical interconnects. The role involves optimizing packaging processes and collaborating with multidisciplinary teams. Candidates with a...3DFull timeApplied Materials
Santa Clara, CA9 hours ago- ...What You’ll Be Doing Own the package‑level reliability spec for... ...to See MS/PhD in Electrical Engineering, Materials Science, Mechanical... ...Strong background in IC packaging and board level reliability... ...Experience with BGA/FCBGA, 2.5D/3D integration, HBM or similar high power,...Senior3D
NVIDIA Gruppe
Santa Clara, CA9 hours ago - ...Description Coherent's Integrated Circuit team designs & develops... ...more than one billion ICs over the past 25 years solving... ...-driven Lead IC Applications Engineer to lead the creation of customer... ...Experience with SI/PI and 2.5D/3D EM board simulation tools is...3D
II-VI Aerospace & Defense
Santa Clara, CA2 days ago $210k - $260k
...innovations across silicon, packaging, software, and systems... ...and has a world-class engineering team with decades of... ...single chip Flip Chip IC integration for next-generation... ...packages and advanced 2.5D integration. You... ...CoWoS‑class interposers 3D packaging and stacking...3DContract workEridu Corporation
Saratoga, CA9 hours ago$180k - $250k
...application development and integrations work (embedded applications,... ...in Computer Science, Computer Engineering or a related area Deep understanding... ...in other adjacent areas (CAD/3D printing, PCB design, etc)... ...of the total compensation package, which may also include equity...Senior3DFull timeApplied Intuition
Sunnyvale, CA8 hours ago$174k - $239.5k
...Materials is a global leader in materials engineering solutions used to produce virtually... ...a subject-matter expert in **Advanced Packaging**. This role sits at the intersection of... ...with **Advanced Packaging** trends (e.g., 2.5D/3D-IC, FOWLP, fan-out/fan-in, advanced...Senior3DFull timeRelocationApplied Materials
Santa Clara, CA9 hours ago- Senior Signal & Power Integrity Engineer What you'll be doing Work on crafting creative Signal and... ...closely with VLSI power teams and package/board design teams to design,... ...‑on experience with PowerSI, 3D modeling tools such as ANSYS HFSS/Q3D, 2.5D tools such as ANSYS...Senior3D
$185k - $230k
...Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink,... ...Overview As a Principal Package Thermal & Mechanical Engineer at Astera Labs, you will... ...and modeling of advanced IC packaging solutions that... ...advanced packaging technologies:2.5D / 3D integration, Chiplet, CPO/...3DFull timeFlexible hours- ...Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions Job Reference #... ...s 3D IC design, multi-die integration, and advanced packaging... ...Administration, Electrical Engineering, Computer Engineering, or... ...packaging technologies (e.g., 2.5D, chiplets, fan-out),...3D
- ...semiconductor design. As a Software Engineer, you will contribute to... ...solutions for advanced 2.5D and 3D System-in-Package (SIP) designs. Your work will involve integrating Siemens’ industry-leading EDA... ...between physical design and 3D-IC planning tools for complex, multi...3D
$184k - $287.5k
...Senior GPU System Architect page is loaded## Senior GPU System Architectlocations... ..., high-bandwidth memory, in-package interconnects and GPU-to-GPU... ...:*** BS/MS/PhD in Electrical Engineering, Computer Engineering, or... ...with interposer or 2.5D/3D package co-design.#LI-HybridYour...Senior3DWorldwideNVIDIA
Santa Clara, CA8 hours ago$163k - $237k
Senior Signal and Power Integrity Engineer corporate_fare Google place Sunnyvale, CA, USA Apply Bachelor's degree... ...in SI/PI design for chip/package or system PCB. Experience in industry... ...Ethernet, PCIe, etc.). Experience with 2.5D/3D package design such as silicon interposer...Senior3DFull timeWorldwide$189k - $301k
...You'll Do As a seasoned Senior Technical Project Manager (... ...firmware, foundry and advanced packaging teams to the customer and... ...Bachelor's degree in Electrical Engineering, Computer Engineering, or... ...with complex packaging (2.5D/3D IC, Si interposers, TSV). Knowledge...Senior3DImmediate startFlexible hoursSamsung Semiconductor
San Jose, CA4 days ago- ...Responsibilities Design and develop multi-fiber module packaging for fiber optic devices and modules tocreate the... ...& Experience BS or MS in Telecom, optomechanical engineering, physics, or related technical fields. Minimum 2 years of related experience. Skills...SeniorWork at office
II-VI UK, Ltd.
Sunnyvale, CA9 hours ago $230k - $265k
...Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink,... ...Labs is seeking a Manager, Package Design Engineering to lead and scale our... ...to-end delivery of advanced IC packaging solutions—from early... ...-based architectures, 2.5D/3D integration, and ever-increasing...3DFlexible hours$200k - $350k
...per 22 CFR 120.62. About the role Own different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects. Work... ...Packaging tools and flows for Multi-die packaging (including 2.5D/3D) ~ Demonstrated ability to work closely with architects to...3DPermanent employmentH1bVisa sponsorshipWork visaDensityAI
Mountain View, CA7 days ago
Do you want to receive more vacancies?
Subscribe and receive similar vacancies to Senior IC Packaging & Integration Engineer (2.5D/3D). Be the first to apply!
Related searches
- semiconductor packaging engineer Santa Clara, CA
- senior packaging engineer Santa Clara, CA
- sr. packaging engineer Santa Clara, CA
- packaging engineer Santa Clara, CA
- system integration engineer Santa Clara, CA
- integration software engineer Santa Clara, CA
- integrations engineer Santa Clara, CA
- senior data integration developer Santa Clara, CA
- senior systems integration engineer Santa Clara, CA
- senior integration developer Santa Clara, CA