Senior IC Packaging & Integration Engineer (2.5D/3D)
$181.1k - $318.4kApple Oakbrook
Apple Inc. is seeking an experienced IC Packaging Engineer in Santa Clara, California. This role involves driving packaging development and leading cross-functional teams in advanced semiconductor packaging solutions. Candidates must have a passion for innovation and at least 10 years of relevant experience. The position offers a competitive salary ranging from $181,100 to $318,400, along with comprehensive benefits including medical coverage, stock options, and educational reimbursements. Apple prides itself on diversity and inclusion, welcoming applicants from all backgrounds. #J-18808-Ljbffr
$181.1k - $318.4k
...looking for versatile and passionate IC Packaging Engineer to join our team! Description You will... ...teams and lead SoC Package integration and architecture efforts Drive the industry... ...advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM). Well versed with DOE...3DRelocationOverseas- NVIDIA Gruppe is seeking an experienced professional to lead package-level reliability for semiconductor products in Santa Clara, California... ...a related field, along with 8+ years of hands-on experience in IC packaging and board level reliability, including familiarity...Senior3D
$180k - $240k
Delos Data Inc, located in Palo Alto, California, is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators. This role involves collaborating with IC design teams and managing vendor relationships...Senior3D$124k - $195.5k
Join us in an outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) at NVIDIA. Using our history of... ...packaging architecture and materials (flip‑chip, 2.5D/3D IC, CoWoS‑R, CoWoS‑L, advanced substrates). Excellent problem...Senior3D$138k - $190k
Advanced Packaging Integration Engineer page is loaded## Advanced Packaging Integration Engineerlocations: Santa... ...innovative advanced packaging and 3D integration solutions.As an **Advanced... ...hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill...3DFull timeWork at officeRelocation$170.7k - $300.2k
...team is looking for a hardworking, IC Packaging Engineer with strong attention for details and... ...will be responsible for packaging integration and package technology development... ...understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology. General...3DFull timeRelocationOverseas- NVIDIA Gruppe is looking for a skilled PCB Layout Engineer to engage in the design and development of advanced IC substrates. The ideal candidate will have 5+ years of relevant experience and a strong background in high-speed design using Cadence APD tools. This position...Senior
- ...technology takes more than great engineering—it takes a team of... ...Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical... ...spanning 2D and RDL based fan-out (2.5D), chiplet-based designs, and heterogeneous integration, leading efforts from early...Senior
$138k - $190k
A leading technology company in Santa Clara is looking for an Advanced Packaging Integration Engineer to develop high-performance optical interconnects. The role involves optimizing packaging processes and collaborating with multidisciplinary teams. Candidates with a M...3DFull time$180k - $250k
...application development and integrations work (embedded applications,... ...in Computer Science, Computer Engineering or a related area Deep understanding... ...in other adjacent areas (CAD/3D printing, PCB design, etc)... ...of the total compensation package, which may also include equity...Senior3DFull timeFor contractorsFor subcontractorCasual workWork at officeRemote workDay shift- What You’ll Be Doing Own the package‑level reliability spec for... ...to See MS/PhD in Electrical Engineering, Materials Science, Mechanical... ...Strong background in IC packaging and board level reliability... ...Experience with BGA/FCBGA, 2.5D/3D integration, HBM or similar high power,...Senior3D
$210k - $260k
...innovations across silicon, packaging, software, and systems... ...and has a world-class engineering team with decades of... ...single chip Flip Chip IC integration for next-generation... ...packages and advanced 2.5D integration. You... ...CoWoS‑class interposers 3D packaging and stacking...3DContract work- Coherent’s Integrated Circuit team designs & develops ASICs for high-... ...delivered more than one billion ICs over the past 25 years... ...-driven Lead IC Applications Engineer to lead the creation of customer... .... Experience with SI/PI and 2.5D/3D EM board simulation tools is...3D
$163k - $237k
Google is seeking a Chip Package Signal Integrity/Power Integrity Engineer to join the ML, Systems, & Cloud AI organization. You will contribute to developing custom silicon solutions that power the future of Google's products. Your responsibilities include managing chip...3D$180k - $240k
...responsibility, and we expect trust, integrity, and respect in how we... ...Press What We Need A Senior Packaging Engineer responsible for... ...delivering advanced multi‑die IC packages for high‑performance... ...multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC,...3DFor subcontractorRemote work- ...student in mechanical engineering, physics, or other similar... ...Perform mechanical integrity and thermal simulations... ...characterization. Support advanced packaging components and test... ...for new products using 3D software and generate... ...for manufacturing of 2.5D/3D packaging....3DFor contractorsWork experience placement
$200k - $350k
...per 22 CFR 120.62. About the role Own different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects. Work... ...Packaging tools and flows for Multi-die packaging (including 2.5D/3D) ~ Demonstrated ability to work closely with architects to...3DPermanent employmentH1bVisa sponsorshipWork visa$168k - $264.5k
NVIDIA Gruppe is seeking a Senior Signal Integrity Engineer for its Packaging and Systems team in Santa Clara, California. The ideal candidate will lead high-speed SerDes channel design and signal integrity analysis. This role requires a strong background in electromagnetics...Senior3D$2,000 per month
...investors and staffed by leading engineers, Etched is redefining the... ...Summary As a Signal & Power Integrity Engineer you will be... ...accelerator platform across silicon, package, and board. The ideal... ...designs and optimization within 2D/2.5D/3D packages Close interaction...3DWork at officeRelocation package$230k - $280k
Cerebras is seeking a skilled engineer to join our physical design team in Sunnyvale, California. You will focus on the design and analysis of 3D integrated products and collaborate with architecture and RTL teams on innovative solutions. The ideal candidate will have...Senior3D$174k - $239.5k
...Materials is a global leader in materials engineering solutions used to produce virtually... ...a subject-matter expert in **Advanced Packaging**. This role sits at the intersection of... ...with **Advanced Packaging** trends (e.g., 2.5D/3D-IC, FOWLP, fan-out/fan-in, advanced...Senior3DFull timeRelocation- Senior Signal & Power Integrity Engineer What you'll be doing Work on crafting creative Signal and... ...closely with VLSI power teams and package/board design teams to design,... ...‑on experience with PowerSI, 3D modeling tools such as ANSYS HFSS/Q3D, 2.5D tools such as ANSYS...Senior3D
$138.8k - $190.85k
SiTime is seeking a Senior Semiconductor Package Engineer in Santa Clara to innovate packaging technologies for MEMS-based timing products. The role involves designing, developing, and qualifying unique custom package technologies while managing production activities at...SeniorOverseas$163k - $237k
Google Inc. is seeking a Chip Package Designer to join their team in Sunnyvale, CA. The role involves developing advanced package substrate... ...designs for Machine Learning chips and collaborating with engineering teams to enhance product performance and efficiency. The ideal...$163k - $237k
Senior Physical Design Flow and Methodology Engineer corporate_fare Google place Sunnyvale, CA, USA... ...verification (Caliber/IC Validator), Formal... ...designs. Familiarity with 2.5D/3D IC packaging and proficiency with... ...architecture and its integration within AI/ML‑driven systems...Senior3DWorldwide$163k - $237k
...Bachelor's degree in Mechanical Engineering, Material Engineering,... ...years of experience in chip package design/layout using Cadence allegro... ...design teams. Experience in 2.5D/3.5D advanced package... ...performance, efficiency, and integration. As a Chip Package Designer,...Worldwide- ...Marketing Programs Manager - 3D IC Design & Advanced Packaging Solutions Job Reference #... ...s 3D IC design, multi-die integration, and advanced packaging... ...Administration, Electrical Engineering, Computer Engineering, or... ...packaging technologies (e.g., 2.5D, chiplets, fan-out),...3D
- NVIDIA is now looking for a Senior Signal Integrity Engineer to join our Packaging and Systems team. What you’ll be doing Lead signal integrity design and analysis... ...for advanced packaging technologies, including 2.5D, 3D, and multi-die integration, focusing on channel...Senior3D
$184k - $287.5k
Senior GPU System Architect page is loaded## Senior GPU System Architectlocations... ..., high-bandwidth memory, in-package interconnects and GPU-to-GPU... ...:*** BS/MS/PhD in Electrical Engineering, Computer Engineering, or... ...with interposer or 2.5D/3D package co-design.#LI-HybridYour...Senior3DWorldwide- ...in Sunnyvale, California, is seeking an experienced engineer to design and develop multi-fiber module packaging for fiber optic devices. Candidates should have a BS... ...physics, or related fields, along with a minimum of 2 years of experience in the industry. The role involves...Senior
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