IC Package Design Engineer for 2.5D/3.5D HPC Substrates
$163k - $237kGoogle Inc.
Google Inc. is seeking a Chip Package Designer to join their team in Sunnyvale, CA. The role involves developing advanced package substrate designs for Machine Learning chips and collaborating with engineering teams to enhance product performance and efficiency. The ideal candidate will have a Bachelor's degree in a relevant field and extensive experience in chip package design. This position offers a competitive salary of $163,000 to $237,000 annually, along with bonuses, equity, and benefits. #J-18808-Ljbffr Google Inc.
Vacancy posted 4 days ago
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