Senior Customer Package Design Integration Engineer (2.5D / 3D Packaging)

Position Overview

We are seeking a highly capable Customer Package Design Integration Engineer (2.5D / 3D Packaging) to ensure the successful execution of customer chiplet-based product development using Rapidus advanced packaging technologies.

This role serves as the primary technical and program interface between Rapidus and customers , integrating ADKs (Assembly Design Kits), packaging technologies, and customer design activities into a unified, successful outcome.

You will combine deep expertise in 2.5D/3D packaging and chiplet integration with strong program management and cross-functional coordination skills to drive customer designs from bring-up through tape-out in a rapidly evolving technology environment.

Locations: Albany, NY (USA) / Santa Clara, CA (USA) / Tokyo (Japan) / Chitose (Japan)

Employment Type: Full-time

Department: Design Enablement / Advanced Packaging Technology

About Rapidus

Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting-edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.

Key Responsibilities

Customer Design Integration & Enablement

• Lead customer design bring-up using Rapidus Assembly Design Kits (ADKs)
• Guide customers in effectively applying:
• Package design rules, libraries, and interface definitions
• Interposer and substrate architectures
• SI/PI/thermal design methodologies
• Provide technical guidance on chiplet integration, including HBM, UCIe, PCIe, and high-speed SerDes

Program Execution & Delivery Ownership

• Drive customer projects toward successful 2.5D/3D package design tape-out and product realization:
• Manage:
• Design schedules and milestones
• Risks, issues, and dependencies
• Cross-functional action items
• Lead regular technical and program reviews with customers and internal teams

Cross-functional Integration (Core Responsibility)

• Act as the central coordination point across:
• Customer engineering teams
• Package Design Engineering
• ADK / Enablement teams
• Process, manufacturing, and OSAT partners
• Translate Rapidus technology updates into clear, actionable guidance for customers
• Ensure alignment between design assumptions and manufacturing capabilities

Technical Issue Resolution

• Support debugging and issue resolution in areas such as:
• SI/PI and signal integrity challenges
• Package layout and routing issues
• ADK usage and interpretation
• Drive root-cause analysis and coordinate solution deployment across teams

Continuous Improvement & Ecosystem Feedback

• Capture customer feedback and drive improvements in:
• ADK quality and usability
• Design methodologies and flows
• Documentation and training materials
• Contribute to strengthening the chiplet ecosystem and customer readiness

Required Qualifications

• B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field
• 5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles
• Strong understanding of:
• 2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out)
• High-speed interfaces (HBM, PCIe, UCIe, SerDes)
• Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)
• Proven ability to manage complex technical programs and cross-functional activities
• Strong communication skills with customer-facing experience

Preferred Qualifications

• Experience in foundry, OSAT, or semiconductor customer support roles
• Familiarity with ADK / PDK and design enablement flows
• Experience with die-package-system co-design methodologies
• Background in HPC, AI, or networking systems
• Experience in silicon bring-up, validation, or failure analysis
• Knowledge of advanced substrates (ABF, glass core, fan-out RDL)
• Japanese language skills for collaboration with Japan-based customers

What You Will Impact

• Ensure successful customer design execution and tape-out delivery
• Bridge the gap between ADK (Assembly Design Kit: design environment) and real product realization
• Integrate design, technology, and execution into a coherent development flow
• Accelerate customer adoption of Rapidus advanced packaging technologies at 2nm and beyond

What We Offer

• Opportunity to play a critical role in customer success for next-generation chiplet platforms
• Work at the intersection of technology, execution, and system integration
• Collaboration with global teams across the US and Japan
• Competitive compensation and career growth opportunities

Benefits

• Comprehensive Health, Dental and Vision coverage, fully at company's expense (no deductibles)
• 401k with no employer match